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Graduate MEMS Packaging Engineer

JR United Kingdom

Colchester

On-site

GBP 30,000 - 40,000

Full time

10 days ago

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Job summary

A leading technology startup is seeking a Graduate MEMS Packaging Engineer in Colchester. This position offers recent graduates an opportunity to gain practical experience in packaging processes and materials for MEMS and antennas while working in a dynamic environment. The role promises hands-on involvement in testing and design efforts crucial to the industry.

Qualifications

  • Recent graduate degree in relevant engineering fields.
  • Exposure to semiconductor packaging, MEMS, or RF technologies is beneficial.

Responsibilities

  • Support the development of MEMS and antenna subassembly packaging processes.
  • Conduct lab-based tests and participate in reliability tests.

Skills

Problem solving mind-set
Strong grasp of fundamental engineering principals

Education

Bachelor’s degree in Electronics Engineering
Bachelor’s degree in Mechanical Engineering
Bachelor’s degree in Materials Science

Job description

Social network you want to login/join with:

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Client:

IC Resources

Location:

colchester, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

  • Strong grasp of fundamental engineering principals (DOE, basic statistics)
  • Problem solving mind-set
  • Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
  • Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.

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