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Graduate MEMS Packaging Engineer

JR United Kingdom

Brighton

On-site

GBP 25,000 - 35,000

Full time

10 days ago

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Job summary

A leading technology startup in the UK is seeking a Graduate MEMS Packaging Engineer. This role provides an excellent opportunity for new graduates to gain hands-on experience in packaging processes and materials within a dynamic team environment, focusing on cutting-edge MEMS technology.

Qualifications

  • Recent graduate with a relevant engineering degree.
  • Understanding of MEMS packaging processes.
  • Willingness to learn and work in a fast-paced environment.

Responsibilities

  • Support development of MEMS and antenna packaging processes.
  • Conduct lab-based tests and reliability tests.
  • Collaborate with the Operations team on engineering projects.

Skills

Engineering principles (DOE, basic statistics)
Problem solving
Semiconductor packaging exposure

Education

Bachelor’s degree in Electronics Engineering
Bachelor’s degree in Mechanical Engineering
Bachelor’s degree in Materials Science

Job description

Social network you want to login/join with:

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Client:

IC Resources

Location:

brighton, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

  • Strong grasp of fundamental engineering principals (DOE, basic statistics)
  • Problem solving mind-set
  • Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
  • Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.

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