Graduate MEMS Packaging Engineer

JR United Kingdom; Guildford; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading company in Guildford seeks a Graduate MEMS Packaging Engineer to join their Operations team. This opportunity is perfect for recent graduates looking to gain hands-on experience in a fast-paced startup environment. Responsibilities include supporting the development of packaging processes and conducting lab tests. Ideal candidates will have a relevant engineering degree and a problem-solving mindset.

Qualifications

• Degree in Electronics, Mechanical Engineering, or Materials Science.
• Hands-on experience with MEMS and antenna subassembly packaging.
• Participation in design and execution of reliability tests.

Responsibilities

• Support the development of MEMS and antenna subassembly packaging.
• Conduct lab-based tests related to MEMS packaging.
• Participate in reliability tests.

Skills

Strong grasp of fundamental engineering principals

Problem solving mind-set

Exposure to semiconductor packaging

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

Location:

guildford, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.