Director of GaN Packaging & High-Voltage Power Modules

Cambridge GaN Devices Ltd; Cambridge; On-site; GBP 90,000 - 150,000; Full time

Benefits offered by this job

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Pension scheme

Life Assurance

Private Health Insurance

Annual leave 33 days

Holiday Purchase Scheme

Training & career development

Family friendly policies

Cycle to work

EV leasing

Volunteer leave

Recruitment referral bonus

Regular social events

Job summary

Cambridge GaN Devices Ltd. is seeking a Director of Packaging to lead our packaging team and advance high‑speed GaN power semiconductor packaging technologies in Cambridge, UK.

You will shape strategy, drive complex decisions, and partner with global suppliers and internal engineering partners to deliver best‑in‑class packaging solutions. The role blends strategic leadership with hands‑on technical work, requiring deep experience in power packaging, multiphysics simulation, and high-voltage

Qualifications

• Bachelor’s degree or higher in Engineering, Physics, Materials or related subject.
• Demonstrable experience in high-volume semiconductor power packaging design & manufacture.
• Experience with supplier design rules and design for manufacture guidelines.
• Familiarity with 600V+ high-power packaging and GaN products is advantageous.

Responsibilities

• Lead design and development of high-performance, high-density packaging solutions.
• Collaborate with internal teams and external partners across UK and overseas.
• Oversee package qualification tests and reliability evaluations.
• Drive technology development and supplier engagement to differentiate CGD products.
• Mentor and develop the packaging team and influence wider strategy.

Skills

Semiconductor packaging

Power electronics

Cross-functional leadership

Problem solving

Project management

Team leadership

Communication

Reliability testing

Design review

Education

Bachelor’s degree or higher in Engineering/Physics/Materials

Tools

Solidworks

Fusion 360

AutoCAD

COMSOL/ANSYS

JIRA

Job description

Cambridge GaN Devices Ltd. is seeking a Director of Packaging to lead our packaging team and advance high‑speed GaN power semiconductor packaging technologies in Cambridge, UK.

You will shape strategy, drive complex decisions, and partner with global suppliers and internal engineering partners to deliver best‑in‑class packaging solutions. The role blends strategic leadership with hands‑on technical work, requiring deep experience in power packaging, multiphysics simulation, and high-voltage