Mechanical Engineer – RF Packaging for EW Systems

Harmattan AI; Paris; Sur place; EUR 65 000 - 90 000; Plein temps

Résumé du poste

Harmattan AI in Paris is seeking a Mechanical Engineer for the Electronic Warfare team to design mechanical structures and packaging that house RF and EW/SIGINT electronics from concept through field deployment.

You will translate RF and electronic constraints into robust mechanical designs, collaborate with hardware, software, GNC and ML teams, and contribute to design reviews, documentation and traceability.

Qualifications

• Experience in RF electronic packaging is a must.
• Previous RF experience (radar, radio or EW) is a strong plus.
• Strong background in mechanical design, thermal management and packaging.
• Broad engineering culture with understanding of electrical and embedded systems.
• MSc in Mechanical Engineering; PhD is a plus.
• Rigorous, structured and mission-driven mindset with strong analytical skills.
• Excellent communication and documentation abilities.

Responsabilités

• RF Electronic Packaging: design mechanical packaging for RF and high-power electronics.
• Thermal Management: design thermal solutions for high-power, high-density electronics.
• Shielding & Cabling: integrate EMI/RF shielding and manage cable routing and constraints.
• Mechanical Design: own mechanical design from concept through prototyping and validation.
• Technical Coordination: collaborate across HW, software, GNC and ML teams on integration and interfaces.
• System Reviews & Documentation: contribute to design and architecture reviews and maintain documentation.

Connaissances

RF packaging

Mechanical design

Thermal management

EMI shielding

Systems knowledge

Formation

MSc Mechanical Engineering

PhD (desired)

Outils

CAD software

FEM

Description du poste

Harmattan AI in Paris is seeking a Mechanical Engineer for the Electronic Warfare team to design mechanical structures and packaging that house RF and EW/SIGINT electronics from concept through field deployment.

You will translate RF and electronic constraints into robust mechanical designs, collaborate with hardware, software, GNC and ML teams, and contribute to design reviews, documentation and traceability.