Mechanical Engineer: RF Packaging for Electronic Warfare

Harmattan AI; Paris; Sur place; EUR 70 000 - 110 000; Plein temps

Résumé du poste

Harmattan AI is seeking a Mechanical Engineer within our Electronic Warfare team to design mechanical structures and packaging for RF and EW electronics, from concept through field deployment. You will translate RF and electronic constraints into robust mechanical designs, working with HW, software, GNC and ML teams to ensure system integrity.

Applicants should have an MSc in Mechanical Engineering (PhD is a plus) and a strong background in RF packaging, thermal management, and EMI

Qualifications

• Experience in RF electronic packaging is a must.
• RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
• Strong background in mechanical design, thermal management and packaging.
• Broad engineering culture with understanding of electrical and embedded systems.
• MSc in Mechanical Engineering; PhD is a plus.
• Rigorous, structured and mission-driven mindset with strong analytical skills.
• Excellent communication and documentation abilities.

Responsabilités

• RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).
• Thermal Management: Design thermal solutions for high-power, high-density electronics.
• Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
• Mechanical Design: Own mechanical design from concept through prototyping and validation.
• Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
• System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

Connaissances

RF electronic packaging

Thermal management

Mechanical design

EMI shielding

Cabling & harnessing

Cross-functional coordination

Formation

MSc in Mechanical Engineering

PhD

Description du poste

Harmattan AI is seeking a Mechanical Engineer within our Electronic Warfare team to design mechanical structures and packaging for RF and EW electronics, from concept through field deployment. You will translate RF and electronic constraints into robust mechanical designs, working with HW, software, GNC and ML teams to ensure system integrity.

Applicants should have an MSc in Mechanical Engineering (PhD is a plus) and a strong background in RF packaging, thermal management, and EMI