Lead Hardware Architect for 3D Chiplet Systems

Vertical Compute SRL; Grenoble; Hybride; EUR 120 000 - 180 000; Plein temps

Résumé du poste

Vertical Compute seeks a Senior Hardware Architect and Team Lead in Grenoble to define and drive next-generation 3D-integrated chiplet products using VIM™ memory. You will own architecture, RTL, verification, DFT, physical implementation, and bring‑up, while building and leading the internal hardware team.

Collaborate with Memory and SW teams to optimize hardware for AI workloads, ensuring robust design practices and on-time silicon tape-out for scalable AI compute solutions.

Qualifications

• 15+ years in ASIC/SoC hardware design and architecture.
• 3+ years leading engineering teams or projects.
• Experience across RTL, verification, DFT, physical design.

Responsabilités

• Define 3D-integrated chiplet architectures and specs.
• Own end-to-end process from architecture to post-silicon bring-up.
• Lead and mentor the internal hardware team; coordinate with external partners.
• Collaborate with memory and SW teams to optimize AI compute hardware.
• Establish design methodologies and review processes for tape-out readiness.

Connaissances

ASIC/SoC design

Team leadership

RTL/SystemVerilog

DFT/Physical design

Memory architectures

Project management

Formation

B.S./M.S./Ph.D. in Electrical/Computer Engineering

Outils

EDA tools

Description du poste

Vertical Compute seeks a Senior Hardware Architect and Team Lead in Grenoble to define and drive next-generation 3D-integrated chiplet products using VIM™ memory. You will own architecture, RTL, verification, DFT, physical implementation, and bring‑up, while building and leading the internal hardware team.

Collaborate with Memory and SW teams to optimize hardware for AI workloads, ensuring robust design practices and on-time silicon tape-out for scalable AI compute solutions.