FAE FPGA

Microchip Technology Inc.; Les Ulis; Sur place; EUR 45 000 - 65 000; Plein temps

Avantages offerts par ce poste

Continuous learning and professional development opportunities

Collaborative engineering culture

Exposure to diverse industries

Résumé du poste

Microchip Technology Inc. is seeking a highly motivated Field Applications Engineer (FAE) specializing in FPGA and SoC solutions to join our team in Les Ulis, France. This role requires close collaboration with customers and sales teams to promote advanced FPGA technologies across various sectors such as Aerospace, Defense, and Industrial.

The ideal candidate will possess a Master's degree in a relevant field and have at least one year of experience in FPGA design, along with strong communication skills in both English and French. We offer continuous learning opportunities and a chance to engage with cutting-edge technologies.

Qualifications

• Minimum 1 year of experience in FPGA design or field application engineering.
• Knowledge of FPGA architectures and development flows.
• Fluent in English and French.

Responsabilités

• Work closely with customers and sales teams to drive FPGA technology adoption.
• Support customer projects in a technical role.
• Present technical solutions to customers.

Connaissances

FPGA design

Digital design

Customer support

Communication skills

Problem-solving

Formation

Master's degree in Electrical Engineering or related field

Outils

VHDL

Verilog/SystemVerilog

FPGA architectures

Description du poste

Job Description

We are seeking a highly motivated Field Applications Engineer (FAE) specializing in FPGA and SoC solutions to join our France-based team. The successful candidate will work closely with customers, sales teams, and product specialists to drive the adoption of advanced FPGA technologies across key market segments including Industrial, Aerospace & Defense, Communications, Smart Energy, Transportation, and Embedded Systems.

This customer‑facing role combines strong technical expertise with business acumen, helping customers accelerate their designs while identifying new opportunities for growth.

Qualifications

• Master's degree in Electrical Engineering, Electronics, Computer Engineering, or related field.
• Minimum 1 year of experience in FPGA design, digital design, or field application engineering.
• Knowledge of:
  • FPGA architectures and development flows
  • VHDL and/or Verilog/SystemVerilog
  • Simulation and verification methodologies
  • Timing analysis and timing closure
  • Embedded systems and processor‑based architectures
  • High‑speed digital interfaces (PCIe, Ethernet, DDR, SERDES, etc.)
• Experience supporting customer projects in a technical role.
• Excellent communication and presentation skills.
• Fluent in English and French.
• Ability to travel regularly within France and occasionally across Europe.

Preferred Qualifications

• Experience with FPGA SoC platforms integrating ARM or RISC‑V processors.
• Knowledge of Linux, RTOS, and embedded software development.
• Experience in Aerospace & Defense, Industrial Automation, Communications Infrastructure, or Automotive applications.
• Familiarity with functional safety and cybersecurity requirements.
• Experience in a customer‑facing role such as FAE, Application Engineer, Design Engineer, or Technical Consultant.

Personal Attributes

• Customer‑first mindset with a passion for solving complex technical challenges.
• Strong teamwork and collaboration skills.
• Self‑motivated and capable of working independently.
• Ability to translate technical capabilities into business value.
• Comfortable operating in a fast‑paced, international environment.
• Strong analytical and problem‑solving abilities.

Why Join Us

• Work with cutting‑edge FPGA and SoC technologies.
• Engage with leading innovators across Europe.
• Influence strategic customer projects from concept to production.
• Be part of a collaborative "One Team" engineering culture.
• Continuous learning and professional development opportunities.
• Exposure to diverse industries and next‑generation embedded systems.

Travel Time

25% - 50%