ATE Test Engineer

IC Resources

Île-de-France

On-site

EUR 60,000 - 90,000

Full time

14 days+

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Job summary

IC Resources is seeking an experienced ATE/Wafer Test Engineer to lead development and qualification of wafer-level test ahead of pre-qualification lots.

You will establish a scalable test infrastructure for III-V photonic devices, coordinating with equipment suppliers, foundry teams and internal engineering groups to enable smooth transitions from development to volume production. The role requires hands-on problem solving across test hardware, software and manufacturing processes.

Qualifications

  • Extensive hands-on wafer test experience in ATE or semiconductor testing.
  • Strong Python or similar scripting for data acquisition and analysis.
  • Practical, hands-on approach across test hardware, software and manufacturing constraints.

Responsibilities

  • Lead technical evaluation, RFQ and qualification of a 300mm-capable wafer prober for III-V devices.
  • Define and develop wafer-level electrical and optical test methods for inline monitoring and screening.
  • Specify test hardware and interfaces to deliver electrical, RF and optical signals to the die.
  • Own test-program development and data-acquisition architecture for integration with volume ATE.
  • Develop test limits and screening strategies balancing coverage, yield and manufacturability.
  • Interface with foundry and test teams to translate manufacturing constraints into test requirements.

Skills

Wafer test engineering
Python scripting
Test automation

Tools

Wafer prober
Probe cards
ATE platforms

Job description

Build the test foundation that takes technology from development into volume manufacturing.

We are looking for an experienced ATE / Wafer Test Engineer to lead the development and qualification of our client's wafer-level test capability ahead of pre-qualification lots and future volume production.

You will play a key role in establishing a credible, scalable test infrastructure for III-V photonic devices, working directly with equipment and probe-card suppliers, foundry test teams and internal engineering teams.

What You'll Do
  • Lead the technical evaluation, RFQ and qualification of a 300mm-capable wafer prober, including chuck, thermal control, vision/alignment and probe-card interface, suitable for III-V photonic devices
  • Define and develop wafer-level electrical and optical test methods, including parametric and PIC-specific testing, for in-line monitoring and eventual high-volume screening
  • Specify and coordinate test hardware, probe cards and probe interface boards capable of delivering combined electrical, RF and optical signals to the die under test
  • Own test-program development and data-acquisition architecture, evolving bench-level R&D setups toward a structure capable of integrating with a volume ATE platform
  • Develop test limits, guard bands and screening strategies from device characterisation data, balancing test coverage, yield impact and manufacturability ahead of pre-qualification lots
  • Own the technical interface with foundry and test teams through short-loop development runs and pre-qualification lots, translating manufacturing constraints into practical test requirements
What We're Looking For
  • Extensive hands-on wafer test, ATE or semiconductor test engineering experience
  • Direct experience specifying, installing, commissioning or operating wafer probers
  • Strong understanding of wafer-level test, probe interfaces and manufacturing test flows
  • Experience with ATE platforms and/or custom electrical/optical test benches, with the ability to define test-hardware and system requirements before a full ATE solution is in place
  • Practical experience supporting technology transfer, foundry qualification or pre-qualification flows, including an understanding of PCM insertion and manufacturing test requirements
  • Strong Python or similar scripting/programming skills for test automation, data acquisition and analysis
  • A hands-on, pragmatic approach: you're comfortable moving between device-level measurements, test hardware, software, equipment and manufacturing requirements.
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