Senior Scientist, Multi-Layered Wiring

VTT; Espoo; On-site; EUR 90,000 - 125,000; Full time

Job summary

VTT is seeking a Senior Scientist, Multi‑Layered Wiring to lead the development of superconducting wiring processes on 200 mm wafers, from R&D to pilot production. You will drive process integration, scale‑up, and data‑driven improvements while mentoring teammates in a world‑class facility in Espoo.

PhD in a related field with 6+ years in micro/nanofabrication is required, along with expertise in lithography, etching, deposition, and DOE/ SPC practices.

Qualifications

• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology or related field.
• At least 6 years of hands-on cleanroom experience, including PhD or postdoc work.
• Expert-level in lithography, dry etching, wet processing, thin film deposition and integration flows.
• Experience with DOE, metrology, SPC, yield analysis and data-driven process optimization.
• Proven track record of scaling R&D processes toward pilot production.
• Ability to own technical workstreams and guide junior colleagues.

Responsibilities

• Lead development, optimization, and qualification of multi-layered superconducting wiring on 200 mm wafers.
• Provide leadership in thin film deposition, lithography, dry etching, and wet processing.
• Define and drive process integration, transfer, scaling, and tool‑matching strategies.
• Develop technical roadmaps for MLW modules aligned with QPU scaling objectives.
• Design and lead DOE campaigns with clear yield and performance targets.
• Lead characterization and data analysis to improve uniformity and device performance.
• Drive production ramp‑up planning, risk mapping, and pilot‑scale readiness.
• Mentor junior colleagues and strengthen team capability, documentation, and safety culture.

Skills

Cleanroom experience

Lithography

Dry etching

Wet processing

Thin film deposition

Process integration

DOE campaigns

Metrology

SPC

Yield analysis

Data-driven optimization

Pilot production

Quantum device fabrication

Education

PhD in applied physics, electrical engineering, materials science, micro/nanotechnology

Job description

Are you a seasoned nanofabrication expert ready to take technical ownership of a critical quantum hardware technology? We are offering an opportunity to lead the development of superconducting multi-layered wiring processes from advanced R&D towards scalable, pilot-ready manufacturing. Would you like to shape process roadmaps, mentor colleagues, and remain deeply hands‑on in world‑class facilities? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well‑being. Our cross‑disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science‑based innovation. In recent years, we have created ground‑breaking innovations such as the world's fastest and most accurate radiation detector, a cancer‑sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.

We are now looking for Senior Scientist, Multi‑Layered Wiring to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team and provide technical leadership across the full multi‑layered wiring process stack on 200 mm wafers, from process development and integration to yield optimization and pilot‑production readiness. In this senior role, you will work with significant autonomy, define technical priorities, lead process scale‑up, and guide junior colleagues. You will combine strategic direction with hands‑on cleanroom work and data‑driven process improvement.

As Senior Scientist, Multi‑Layered Wiring, you will:

• Lead the development, optimization, and qualification of multi-layered superconducting wiring processes on 200 mm wafers
• Provide expert leadership in thin film deposition, lithography, dry etching, and wet processing
• Define and drive process integration, transfer, scaling, and tool‑matching strategies
• Develop the technical roadmap for MLW modules in alignment with QPU scaling objectives
• Design and lead DOE campaigns with clear yield and performance targets
• Establish SPC, process monitoring, yield KPIs, and production‑quality guardrails
• Lead characterization and data analysis to improve uniformity, reproducibility, and device performance
• Drive production ramp‑up planning, risk mapping, and pilot‑scale readiness
• Lead technical contributions to EU projects, publications, and external partnerships
• Mentor junior colleagues and strengthen team capability, documentation, and safety culture

Who we are looking for:

• For this position, we are looking for an experienced micro- and nanofabrication specialist who can take ownership of a complex technology area and lead its transition from research towards reproducible pilot‑scale production.
• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands‑on cleanroom experience, including PhD or postdoctoral work
• Expert‑level experience in lithography, dry etching, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and data‑driven process optimization
• Demonstrated track record of scaling R&D processes towards pilot production
• Ability to independently own technical workstreams and guide junior colleagues
• We also appreciate experience in experience with superconducting film integration or quantum device fabrication; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with in‑line characterization, mask design, RF simulations, or scientific programming.

As a person, we hope that you are:

• Strategic and hands‑on, able to lead both from the cleanroom and the planning table
• A natural mentor who supports the development of junior colleagues
• Rigorous and data‑driven, with a strong focus on reproducibility and documentation
• A proactive problem solver who turns technical complexity into clear priorities
• An excellent communicator with internal and external stakeholders
• Committed to quality, safety, collaboration, and continuous improvement>

Interested and want to know more?

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

We look forward to hearing from you!

VTT Location: Tietotie 3, Espoo