Senior Scientist, QPU Integration and TSV Technologies

VTT; Espoo; On-site; EUR 90,000 - 130,000; Full time

Job summary

VTT in Espoo, Finland seeks a Senior Scientist to lead superconducting TSV and QPU integration development, from concept to pilot production. You will guide lithography, DRIE/RIE/ICP-RIE, and thin-film deposition while shaping the technical roadmap and ensuring scalable production readiness.

You will mentor scientists and engineers, collaborate with industry and academic partners, and drive DOE-driven optimization campaigns to improve yield and electrical performance.

Qualifications

• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar.
• At least 6 years of hands-on cleanroom experience, including PhD or postdoctoral work.
• Expert-level skills in lithography, DRIE/RIE/ICP-RIE, wet processing, thin film deposition, and integration flows.
• Strong experience with DOE, metrology, SPC, yield analysis, and process control.
• Demonstrated success in scaling R&D processes towards pilot production.
• Proven ability to own technical workstreams, lead projects, and guide junior colleagues.

Responsibilities

• Lead the development, optimization, and qualification of superconducting TSV processes on 200 mm wafers.
• Provide expert leadership in thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing.
• Define and own the technical roadmap for TSV and QPU integration modules.
• Drive process transfer, scaling, and tool-matching strategies across platforms.
• Lead targeted DOE campaigns for yield, uniformity, and electrical performance optimization.
• Establish and own SPC frameworks, process control points, yield KPIs, and quality guardrails.
• Direct wafer-level characterization and correlate process parameters with Ic, Tc, uniformity, and QPU performance.
• Lead production ramp-up planning, risk assessment, and pilot-scale readiness.
• Provide technical leadership in EU, industrial, and academic projects.
• Own technology transfer and documentation standards and mentor research scientists and engineers.

Skills

Advanced microfabrication

Superconducting TSV

DOE

Metrology

Yield analysis

Project leadership

Mentoring

R&D to production

Education

PhD in applied physics / electrical engineering

Tools

DRIE/RIE/ICP-RIE

Lithography equipment

Thin film deposition

Wafer bonding

Job description

Are you an experienced semiconductor or quantum device fabrication expert ready to lead a breakthrough integration technology? We are offering an opportunity to take technical ownership of superconducting through-silicon via and QPU integration processes, from concept to pilot-ready production. Would you like to shape Europe's quantum hardware roadmap while mentoring talented colleagues and collaborating with leading partners? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra .

Senior Scientist, QPU Integration and TSV Technologies

We are now looking for Senior Scientist, QPU Integration and TSV Technologies to join our Quantum Scaling and Integration team.

Key responsibilities

• Lead the development, optimization, and qualification of superconducting TSV processes on 200 mm wafers
• Provide expert leadership in thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing
• Define and own the technical roadmap for TSV and QPU integration modules
• Drive process transfer, scaling, and tool-matching strategies across platforms
• Lead targeted DOE campaigns for yield, uniformity, and electrical performance optimization
• Establish and own SPC frameworks, process control points, yield KPIs, and quality guardrails
• Direct wafer-level characterization and correlate process parameters with Ic, Tc, uniformity, and QPU performance
• Lead production ramp-up planning, risk assessment, and pilot-scale readiness
• Provide technical leadership in EU, industrial, and academic projects
• Own technology transfer and documentation standards and mentor research scientists and engineers

Who we are looking for

• For this position, we are looking for a senior expert in advanced microfabrication and integration who can independently lead superconducting TSV technologies from frontier research towards controlled, wafer-scale production.
• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands-on cleanroom experience, including PhD or postdoctoral work
• Expert-level skills in lithography, DRIE/RIE/ICP-RIE, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and process control
• Demonstrated success in scaling R&D processes towards pilot production
• Proven ability to own technical workstreams, lead projects, and guide junior colleagues
• We also appreciate experience in direct experience in superconducting TSV fabrication; knowledge of CMP, wafer bonding, or advanced packaging for 3D integration; familiarity with sheet resistance, stress measurement, probing, mask design, or RF simulations.

As a person, we hope that you are

• A deep technical expert who leads by example and remains hands-on
• A natural mentor who invests in the success of colleagues
• Rigorous, disciplined, and data-driven, with high standards for quality
• A clear communicator who can work effectively with diverse stakeholders
• Comfortable taking ownership and making well-founded technical decisions
• Energized by turning frontier science into manufacturable quantum hardware

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

We look forward to hearing from you!

VTT Location: Tietotie 3, Espoo