Lead Scientist, QPU Integration & Superconducting TSV

VTT; Espoo; On-site; EUR 90,000 - 130,000; Full time

Job summary

VTT in Espoo, Finland seeks a Senior Scientist to lead superconducting TSV and QPU integration development, from concept to pilot production. You will guide lithography, DRIE/RIE/ICP-RIE, and thin-film deposition while shaping the technical roadmap and ensuring scalable production readiness.

You will mentor scientists and engineers, collaborate with industry and academic partners, and drive DOE-driven optimization campaigns to improve yield and electrical performance.

Qualifications

• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar.
• At least 6 years of hands-on cleanroom experience, including PhD or postdoctoral work.
• Expert-level skills in lithography, DRIE/RIE/ICP-RIE, wet processing, thin film deposition, and integration flows.
• Strong experience with DOE, metrology, SPC, yield analysis, and process control.
• Demonstrated success in scaling R&D processes towards pilot production.
• Proven ability to own technical workstreams, lead projects, and guide junior colleagues.

Responsibilities

• Lead the development, optimization, and qualification of superconducting TSV processes on 200 mm wafers.
• Provide expert leadership in thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing.
• Define and own the technical roadmap for TSV and QPU integration modules.
• Drive process transfer, scaling, and tool-matching strategies across platforms.
• Lead targeted DOE campaigns for yield, uniformity, and electrical performance optimization.
• Establish and own SPC frameworks, process control points, yield KPIs, and quality guardrails.
• Direct wafer-level characterization and correlate process parameters with Ic, Tc, uniformity, and QPU performance.
• Lead production ramp-up planning, risk assessment, and pilot-scale readiness.
• Provide technical leadership in EU, industrial, and academic projects.
• Own technology transfer and documentation standards and mentor research scientists and engineers.

Skills

Advanced microfabrication

Superconducting TSV

DOE

Metrology

Yield analysis

Project leadership

Mentoring

R&D to production

Education

PhD in applied physics / electrical engineering

Tools

DRIE/RIE/ICP-RIE

Lithography equipment

Thin film deposition

Wafer bonding

Job description

VTT in Espoo, Finland seeks a Senior Scientist to lead superconducting TSV and QPU integration development, from concept to pilot production. You will guide lithography, DRIE/RIE/ICP-RIE, and thin-film deposition while shaping the technical roadmap and ensuring scalable production readiness.

You will mentor scientists and engineers, collaborate with industry and academic partners, and drive DOE-driven optimization campaigns to improve yield and electrical performance.