Package Design Engineer Imaging Tech (Remote)

Teledyne; Sevilla; Presencial; EUR 60.000 - 85.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Teleworking agreement

Structured onboarding

International exposure

Descripción de la vacante

Teledyne e2v Semiconductors SAS is recruiting a Package Design Engineer to drive the complete design flow for advanced microelectronic packages. Based near Grenoble or Seville, you will translate customer needs into technical specs and coordinate with vendors and assembly houses throughout the life cycle.

You will conduct simulations, reviews, and DRC checks, and lead initiatives on imaging package technologies while maintaining strong interface with project teams and suppliers.

Formación

• Background in microelectronics, electronics or micromechanics.
• First confirmed experience in packaging design is required.
• Imaging and/or assembly experience is a plus.
• Experience managing package vendors and assembly houses.
• Knowledge of packaging flow: spec, solutions, design, validation.

Responsabilidades

• Lead the full design flow of organic and ceramic multi‑layer packaging (BGA, PGA, CLCC, CQFP, WLCSP).
• Interface with packaging vendors and assembly houses throughout the project lifecycle.
• Perform electrical, thermal and mechanical simulations as needed.
• Conduct design reviews and ensure compliance with customer specs.
• Monitor emerging technologies and drive R&D for imaging packages.

Conocimientos

Microelectronics

Packaging design

Imaging experience

Vendor management

Electrical/thermal/mechanical sims

Cadence APD or equivalent

SolidWorks

Educación

Physics/Engineering background

Herramientas

Cadence Xtract IM

Descripción del empleo

Teledyne e2v Semiconductors SAS is recruiting a Package Design Engineer to drive the complete design flow for advanced microelectronic packages. Based near Grenoble or Seville, you will translate customer needs into technical specs and coordinate with vendors and assembly houses throughout the life cycle.

You will conduct simulations, reviews, and DRC checks, and lead initiatives on imaging package technologies while maintaining strong interface with project teams and suppliers.