Imaging Package Design Engineer – Microelectronics

Teledyne Technologies Incorporated; Sevilla; Presencial; EUR 42.000 - 65.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Teleworking agreement

Structured onboarding with mentor

Descripción de la vacante

Teledyne Technologies Incorporated is recruiting for a Package Design Engineer. The role can be based at our Seville site in Spain or at the Saint-Egrève site near Grenoble, France.

You will lead the complete design flow of advanced microelectronic packages and work closely with packaging vendors and assembly houses to ensure robust, reliable solutions. You will monitor emerging technologies, drive R&D initiatives, and contribute to ongoing improvement of imaging packages in a global,

Formación

• Background in microelectronics or electronics engineering.
• First confirmed experience in packaging design.
• Experience with imaging/vision-related packaging is a plus.

Responsabilidades

• Lead the full design flow of organic and ceramic multi-layer packaging (BGA, PGA, CLCC, CQFP, WLCSP).
• Collaborate with packaging vendors and assembly houses throughout the project lifecycle.
• Monitor technologies and drive R&D or continuous improvement in imaging packages.

Conocimientos

Microelectronics background

Packaging design experience

Signal integrity

Cadence APD

Thermal modeling

Mechanical design basics

Vendor management

English/French proficiency

Educación

Engineering degree (electronics/microelectronics)

Herramientas

Cadence APD

Cadence Xtract IM

Ansys

SolidWorks

Descripción del empleo

Teledyne Technologies Incorporated is recruiting for a Package Design Engineer. The role can be based at our Seville site in Spain or at the Saint-Egrève site near Grenoble, France.

You will lead the complete design flow of advanced microelectronic packages and work closely with packaging vendors and assembly houses to ensure robust, reliable solutions. You will monitor emerging technologies, drive R&D initiatives, and contribute to ongoing improvement of imaging packages in a global,