Technical Program Manager (f/m/d)

Ignite Next GmbH; Aachen; Hybrid; EUR 90.000 - 140.000; Vollzeit

Zusammenfassung

Black Semiconductor GmbH in Aachen, NRW, Germany seeks a Technical Program Manager to oversee ASIC and photonics development programs, including multi-die chiplet packaging, from concept through validation and release.

You will lead cross-functional engineering teams, coordinate external IP providers, drive schedules, and ensure milestones meet time, technical, cost and quality targets. Based in Aachen with on-site collaboration; fluency in English is required and German plus PM cert is a plus.

Qualifikationen

• 5–8 years of experience managing silicon, ASIC, IP, or photonics development programs (concept through release).
• Experience with external IP vendors, qualification providers, or test houses in chiplet/multi-die environments.
• Strong ability to translate product requirements into executable technical plans and manage milestones, metrics, schedules, risks, and dependencies.

Aufgaben

• Collaborate with cross-functional engineering teams and product management to set milestones and mitigate risks.
• Develop schedules, identify critical paths, and maintain execution across programs.
• Coordinate conception, development, and delivery of ASIC and photonic IC programs, including multi-die integration.
• Own relationships with external IP and qualification providers; track deliverables and escalate risks.
• Translate product requirements into executable technical programs and maintain alignment between teams.

Kenntnisse

Cross-functional leadership

Program management

Silicon/ASIC development

Photonic integration

Chiplet packaging

Risk management

Stakeholder communication

Ausbildung

Bachelor's degree in Engineering, Computer Science, or related technical field

Tools

PLM systems

Jobbeschreibung

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude

In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

Black Semiconductor GmbH is looking for a Technical Program Manager for a new product launch who will be responsible for overseeing the development and delivery of Application Specific Integrated Circuit (ASIC) programs combining electronics and photonics in advanced chiplet packages. The role involves leading and supporting cross-functional engineering teams, partnering closely with product management on scope and priorities, and coordinating external third-party IP and qualification providers to ensure the program meets time, technical, cost and quality targets.

As the Technical Program Manager, you will oversee the complete silicon and chiplet program cycle, from initial concept through implementation, validation, qualification, and final release to product — combining hands-on program management with enough technical fluency to catch integration and schedule risk before it becomes a crisis. You will drive program schedules, resolve technical and cross-functional issues, and lead the Program Core Team to align decisions, manage dependencies, and execute against milestones. This is a mid-level role: you'll take ownership of a defined program end-to-end rather than coordinating meetings for others, but you won't be expected to build program management infrastructure from the ground up on day one.

To join our team, you should be excited to

• Collaborate with cross-functional engineering teams and product management to set milestones, create integration plans, and address potential risks with mitigation strategies for next-generation chiplet products.
• Develop schedules, identify critical paths and bottlenecks, and maintain execution throughout the duration of programs.
• Coordinate the timely conception, development, and delivery of Application-Specific electronic and photonic integrated circuit programs, including multi-die/chiplet integration and known-good-die qualification.
• Own the relationship with external third-party IP and qualification providers — tracking their deliverables against program milestones, running regular review cadences, and escalating risks before they hit the critical path.
• Partner with product management to translate product requirements and priorities into an executable technical program plan, and keep both sides aligned as scope or schedule trade-offs come up.
• Build and maintain strong working relationships and communicate effectively across multidisciplinary teams and leadership.
• Manage chip delivery for development builds and ensure qualification to meet mass production schedules.
• Serve as the primary point of accountability for program execution.
• Ensure program documents are complete, up-to-date, and accessible.
• Manage external suppliers more broadly. This includes allocating resources, establishing review processes, and coordinating with supply chain and operations.

Your Qualification

• Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.
• 5–8 years of experience managing silicon, ASIC, IP, or photonics development programs, with proven ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release.
• Experience managing complex semiconductor programs involving external IP vendors, qualification providers, or test houses, ideally within chiplet, multi-die, or advanced packaging environments.
• Strong ability to translate product requirements into executable technical plans, manage priorities and trade-offs, and drive execution through defined milestones, metrics, schedules, risks, and dependencies.
• Experience leading cross-functional engineering teams and collaborating effectively with Product Management, suppliers, manufacturing partners, and external stakeholders.
• Hands-on experience with ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, PLM systems, risk management, change control, supplier coordination, and program tracking tools.
• Strong communication, problem-solving, and stakeholder management skills, with the ability to work independently and within multidisciplinary teams.
• Results-oriented, proactive, and self-motivated, with strong analytical, creative, and critical thinking skills.
• Fluency in English is required; German language skills and Program Management certification are considered a plus.
• Knowledge of semiconductor industry trends and disruptive technologies, including chiplet architectures and advanced packaging ecosystems, is considered a plus.

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development

Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future

We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fuelling innovation and driving us forward

We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation and growth. Join our team and be part of an organization dedicated to making a difference in the industry

If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.