Senior Integrated Photonics Packaging Engineer(RF)

Q.ant GmbH; Stuttgart; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

Q.ANT GmbH in Germany is advancing photonic computing through high-density electro-optical and RF packaging that unites PICs, light sources, photodetectors, and analog circuitry.

As Senior Integrated Photonics Packaging Engineer, you will drive the transition from R&D prototypes to compact, high-performance modules, lead supplier-driven packaging projects, and verify SI/PI while collaborating with global teams to implement new packaging architectures.

Qualifikationen

• M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics or related field; equivalent industry experience also considered.
• 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies.
• Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation.
• Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding.
• Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI).
• Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (Telcordia, JEDEC).
• Solution-oriented mindset with high attention to detail, proactive ownership, cross-functional communication skills.
• Fluent in English; knowledge of German or another European language is a plus.

Aufgaben

• Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)
• Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation
• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques
• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)
• Execute thermal management strategies for high-power photonic and high-frequency devices
• Establish quality assurance and verification protocols to achieve ≥95% first-pass qualification on supplier-delivered modules
• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP
• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Kenntnisse

RF packaging

optoelectronic integration

supplier management

EMC shielding

thermal management

CAD tools

S-parameter measurements

electronics packaging

Ausbildung

M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or related field

Tools

CAD tools

Jobbeschreibung

Your mission

The future of AI computing is light, not electrons.
At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing.
As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology.

Your Impact & Responsibilities

• Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)


• Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation


• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques


• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)


• Execute thermal management strategies for high-power photonic and
  high-frequency devices


• Establish quality assurance and verification protocols to achieve ≥95%
  first-pass qualification on supplier-delivered modules


• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP


• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Your profile

• M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered


• 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies


• Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation


• Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding


• Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)


• Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC)


• Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills


• Fluent in English; knowledge of German or another European language is a plus

Why us?

• Work on the leading edge: Shapedeep-techevolutionbydevelopingnovelhigh frequencypackagingarchitecturesthatpushthephysicalboundariesofAIcomputing.


• Make impact at scale:Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market.


• Broad decision-making authority: Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies.


• Fast-track your growth:Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP.


• World-class team:Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems.


• Direct access to leadership: Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry.