Senior RF / Analog Design Engineer (m/f/d)

Q.ant GmbH; Stuttgart; Vor Ort; EUR 70.000 - 90.000; Vollzeit

Zusammenfassung

Q.ant GmbH in Stuttgart is looking for a Senior GHz Analog & Mixed-Signal Engineer (m/f/d) to architect high-speed signal paths for photonic computing. Candidates should have 5+ years of experience in analog circuit design and be proficient in tools like SPICE and MATLAB.

The position involves cutting-edge technology integration and offers a dynamic work environment. Fluent English is required, knowledge of German is a plus.

Qualifikationen

• 5+ years designing analog/mixed-signal circuits in the 1–20 GHz range.
• Strong command of SPICE/Spectre, ADS, HFSS.
• Hands-on background integrating electronics with silicon photonic components.

Aufgaben

• Specify, design, and simulate GHz-band circuits optimizing for noise and power efficiency.
• Define electrical-optical impedance matching for silicon photonic components.
• Lead hands-on characterization of system-level behavior using various instruments.

Kenntnisse

Analog/Mixed-Signal Circuit Design

RF Electronics

Signal Integrity

Electro-Optic Integration

Noise Optimization

Ausbildung

M.S. or Ph.D. in Electrical Engineering, Physics, Microsystems Engineering

Tools

SPICE

SpectreRF

ADS

Python

MATLAB

Jobbeschreibung

Your mission

The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior GHz Analog & Mixed-Signal Engineer (m/f/d), you are the architect of the high-speed electronic signal paths in the GHz-range that make photonic computing real. You will design, simulate, and validate circuits that interface directly with cutting-edge silicon photonic devices, custom ASICs, and advanced 2.5D/3D interposer platforms. Working at the intersection of RF electronics, electro-optics, and semiconductor heterogeneous integration, you will turn individual high-performance components into unified, scalable subsystems.

Your Responsibilities

• High-Speed Analog & Mixed-Signal Design: Specify, design, and simulate GHz-band circuits including TIAs, ADC/DAC front-ends, amplifiers, and PLLs – optimizing for noise, linearity, jitter, bandwidth, and power efficiency using tools such as SPICE, SpectreRF, and ADS.
• Electronic-Photonic Co-Design: Define and optimize electrical-optical impedance matching, biasing, and signal conditioning for silicon photonic components including modulators, photodetectors, and waveguide interfaces.
• Interposer & Advanced Packaging Integration: Develop and validate 2.5D/3D integration architectures using interposers and chiplets; co-simulate RF parasitics, TSV routing, and thermal behavior to ensure signal integrity across heterogeneous boundaries.
• ASIC Collaboration: Partner with ASIC designers to define high-speed interface requirements and support SerDes, CDR, and mixed-signal block integration.
• Lab Bring-Up & Validation: Lead hands‑on characterization of electro‑optic bandwidth, eye diagrams, jitter, noise spectra, and system‑level behavior using oscilloscopes, VNAs, BERTs, and spectrum analyzers.
• Innovation & IP Contribution: Propose novel analog architectures and co‑integration strategies that push beyond conventional design limits, contributing to Q.A.N.T's IP portfolio and next‑generation photonic processor roadmap.

Your profile

• Educational Foundation:M.S. or Ph.D. in Electrical Engineering, Physics, Microsystems Engineering, or a related technical field.
• Industry Expertise:5+ years designing analog/mixed‑signal circuits in the 1–20 GHz range, with strong command of SPICE/Spectre, ADS, HFSS, and S-parameter/EM co-simulation.
• Electro-Optic Experience:Hands‑on background integrating electronics with silicon photonic or optoelectronic components – modulators, photodiodes, optical packaging – is a strong advantage.
• Packaging & SI/PI Know-How:Demonstrated experience with high-speed PCB design, signal and power integrity analysis, and advanced packaging concepts (CoWoS, EMIB, or similar).
• Analytical Toolset:Familiarity with Python or MATLAB for measurement automation and data analysis; experience defining test SOPs for reproducibility.
• Language:Fluent English required; German or another European language is a plus.