Senior Photonic Integration Engineer

Q.ant GmbH; Stuttgart; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

Q.ANT is seeking a Senior Photonic Integration Engineer in Stuttgart to drive full-cycle co-integration of photodiodes, photodetectors, and lasers into PICs. You will span concept to validation, leveraging opto-electronic expertise and microfabrication know-how to shape integration requirements and fabrication flows.

You will lead cross-functional teams, manage schedules and milestones, and coordinate with external partners to deliver reliable hardware for next-generation AI and HPC platforms.

Qualifikationen

• PhD in Electrical Engineering, Photonics, Physics or Master’s with 3+ years industry experience.
• Deep understanding of photodiode/laser physics and hybrid optoelectronic integration.
• Hands-on PIC fabrication, testing, and optical alignment experience.
• Familiar with LNOI, InP, or SiPh platforms is preferred.

Aufgaben

• Lead cross-functional projects on hybrid integration of photodiodes, lasers, and active components on PICs.
• Define, plan, and execute full-cycle integration workflows from design to bring-up.
• Bridge PIC fabrication flows with active-component integration to ensure high yield.
• Perform system-level testing and optical alignment with electronics for readout.
• Manage schedules, risks, configuration control, and action logs for projects.
• Coordinate external partners and suppliers to meet milestones.
• Balance optical/electrical trade-offs to optimize yield, bandwidth, and SNR.

Kenntnisse

Photonic integration

PIC platforms

TIA/driver design

Optical alignment

Wafer-level process development

Ausbildung

PhD in Electrical Engineering or Photonics

Master’s with 3+ years experience

Tools

Photolithography

Etch

Deposition

Wafer bonding

Jobbeschreibung

Your mission

The future of AI computing is light, not electrons. At Q.ANT, we are building photonic processing systems that compute with light—delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and high-performance computing. As Senior Photonic Integration Engineer, you will drive the full-cycle co-integration of active components—specifically photodiodes, photodetectors, and lasers—into Q.ANT’s Photonic Integrated Circuits (PICs). Spanning the entire workflow from concept to characterized and validated assemblies, you will leverage deep opto-electronic expertise and microfabrication knowledge (photolithography, etch, deposition) to shape integration requirements and directly influence the fabrication flow. You will bridge PIC design, fabrication, electronics, and packaging to deliver reliable hardware that powers our roadmap.

Your Impact & Responsibilities

• Lead cross-functional projects focused on the hybrid integration of photodiodes, lasers, and active components on PIC platforms (LNOI,InP,SiPh)
• Define, plan, and execute full-cycle integration workflows—frominitialdesign through fabrication, build, characterization, and system bring-up
• Bridge the gap between PIC fabrication flows and activecomponentintegration,establishingreproducible, high-yield co-integration processes
• Perform system-level testing and optical alignment, interfacing with electronic teams for signal readout (TIA/driver) and performance evaluation
• Manage cross-functional team efforts,establishingproject schedules, risk mitigations, configuration control, and action logs
• Coordinate external suppliers, research partners, and service providers to ensuretimelyexecution against project milestones
• Balance complex optical and electrical trade-offs (responsivity vs. bandwidth vs. noise) toboptimizeassembly yield, SNR, and throughput

Your profile

• Ph.D. in Electrical Engineering, Photonics, Physics, or Master’s degree with 3+ years of relevant industry/research experience
• Deep understanding of photodiode and laser physics, hybrid optoelectronic integration, and TIA/driver design and characterization
• Hands‑on experience with the complete PIC fabrication process flow (photolithography, etch, deposition) and wafer‑level process development
• Proven experience in hands‑on PIC testing, optical alignment, and system bring‑up; familiarity with LNOI, InP, or SiPh platforms preferred
• Solution‑oriented mindset with high attention to detail, strong ownership, self‑leadership, and commitment to project execution
• Excellent communication and collaboration skills with experience leading cross‑functional teams and external partners
• Fluent in English; knowledge of German or another European language is a plus

Why us?

• Work on the leading edge: Shape the future of photonic computing by co-integrating active components with next‑generation PIC platforms.
• Make impact at scale: Directlyoptimizeassembly yield, bandwidth, and SNR, driving technology from early prototypes into scalable, high‑performance computing systems.
• Broad autonomy:Enjoy wide freedom to design novel integration flows, select materials/attachment methods, introduce automation strategies, and propose new process trials.
• Fast‑track your growth:Work on multi‑disciplinary challenges that combine microfabrication, optics, and high‑speed electronics—building new institutional knowledge and industry‑defining IP.
• World‑class team: Collaborate with an international team of cross‑functional experts in photonics, semiconductor processing, electronics, and packaging.
• Direct access to leadership: Work closely with engineering leads, company founders, and an advisory board that has shaped the semiconductor industry.