Senior Integrated Photonics Packaging Engineer (RF)

Q.ant GmbH; Stuttgart; On-site; EUR 90,000 - 130,000; Full time

Job summary

Q.ANT GmbH in Stuttgart is developing photonic computing and seeks a Senior Integrated Photonics Packaging Engineer to move photonic technology from R&D prototypes to miniaturized, high-performance modules. You will own high-density electro-optical and RF packaging, manage global suppliers, and verify SI/PI, EMC, and thermal performance while advancing new materials and IP.

Collaboration with R&D, systems, manufacturing and test teams is essential. Applicants should have a Ph.D./M.S.

Qualifications

• MSc/PhD in Electrical Engineering, Photonics, Optoelectronics, Physics or related field; equivalent industry experience considered
• 5+ years hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies
• Proven track record managing supplier-led R&D projects from requirements through integration and validation
• Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding
• Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)
• Familiarity with CAD tools for electronic packaging, SPC, and industry standards (Telcordia, JEDEC)
• Solution-oriented mindset with strong attention to detail, ownership, and cross-functional communication
• Fluent in English; knowledge of German or another European language is a plus

Responsibilities

• Define and own high-density electro-optical and RF packaging solutions, ensuring SI and PI
• Lead supplier-driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation
• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques
• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)
• Execute thermal management strategies for high-power photonic and high-frequency devices
• Establish quality assurance and verification protocols to achieve ≥95% first-pass qualification on supplier-delivered modules
• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP
• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Skills

RF packaging

optoelectronic integration

high-density interconnect

EM simulation tools

S-parameter measurements

EMC shielding

CAD tools for electronic packaging

Thermal management

Supplier management

English fluency

Education

MSc/PhD in Electrical Engineering, Photonics, Optoelectronics, Physics

Tools

EM simulation software

PCB/Package layout tools

Job description

Your mission

The future of AI computing is light, not electrons.
At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing.
As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology.

Your Impact & Responsibilities

• Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)


• Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation


• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques


• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)


• Execute thermal management strategies for high-power photonic and
  high-frequency devices


• Establish quality assurance and verification protocols to achieve ≥95%
  first-pass qualification on supplier-delivered modules


• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP


• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Your profile

• M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered


• 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies


• Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation


• Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding


• Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)


• Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC)


• Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills


• Fluent in English; knowledge of German or another European language is a plus

Why us?

• Work on the leading edge: Shapedeep-techevolutionbydevelopingnovelhigh frequencypackagingarchitecturesthatpushthephysicalboundariesofAIcomputing.


• Make impact at scale:Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market.


• Broad decision-making authority: Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies.


• Fast-track your growth:Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP.


• World-class team:Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems.


• Direct access to leadership: Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry.