Senior Engineer – Power Magnetics & Module Design | MRL Consulting

MRL Consulting Group Ltd.; Deutschland; Vor Ort; EUR 85.000 - 120.000; Vollzeit

Zusammenfassung

MRL Consulting Group Ltd. is recruiting a Senior Power Magnetics & Module Design Engineer to develop high-density, high-frequency power solutions for next-generation processors and data centre applications.

The role spans advanced power electronics, magnetics, packaging and power delivery architectures, with collaboration across prototypes and suppliers to bring designs to life.

Qualifikationen

• Master’s or PhD in Electrical Engineering or related field, with focus on power electronics.
• Extensive experience in power magnetics, power modules and data-centre power systems.
• Proven track record in high-frequency power delivery architectures and planar magnetics.

Aufgaben

• Design and optimise magnetics for DC-DC converters, aiming for efficiency, footprint and thermal performance.
• Develop PoL, IVR/VRM and isolated DC-DC power modules.
• Create advanced power module architectures, including 3D stacking and embedded magnetics.
• Perform electromagnetic, thermal and mechanical modelling and FEA simulations.
• Collaborate with prototypes and suppliers to validate designs.
• Develop simulation tools and automated workflows to improve design efficiency.

Kenntnisse

Power magnetics

Power modules

Data centre power systems

High-frequency architectures

Packaging & PCB magnetics

FEM multi-physics simulations

COMSOL

Thermal modelling

Silicon/LV GaN

Analytical/problem-solving

English communication

Ausbildung

Master’s or PhD in Electrical Engineering / Microelectronics / Materials Science

Tools

COMSOL

Jobbeschreibung

Senior Engineer – Power Magnetics & Module Design

We are recruiting on behalf of a leading global technology organisation for a Senior Power Magnetics & Module Design Engineer to develop high-density, high-frequency power solutions for next-generation processors and data centre applications.

This role offers the opportunity to work across advanced power electronics, magnetics, packaging and power delivery architectures.

Key Responsibilities

• Design and optimise magnetics for package- and board-level DC-DC converters, focusing on efficiency, footprint and thermal performance.

• Develop Point-of-Load (PoL), IVR/VRM and isolated DC-DC power modules.

• Design advanced power module architectures, including 3D stacking and PCB/substrate-embedded magnetics.

• Perform electromagnetic, thermal and mechanical modelling and FEA simulations.

• Collaborate with prototype teams and suppliers to develop and validate designs.

• Develop simulation tools and automated workflows to improve design efficiency.

Key Requirements

• Master’s or PhD in Electrical Engineering, Microelectronics, Materials Science or a related discipline, ideally with a focus on integrated power electronics.

• Strong industry experience in power magnetics, power modules and data centre power systems.

• Proven experience designing high-frequency package-, board- and system-level power delivery architectures.

• Expertise in high-density inductors and planar transformers, including LLC and HSC topologies.

• Strong knowledge of advanced packaging and PCB/substrate-embedded magnetics manufacturing.

• Experience with Silicon/LV GaN and electrical, thermal and mechanical modelling.

• Knowledge of high-frequency magnetic materials, loss modelling and reliability testing, particularly at 5MHz+.

• Experience with FEM multi-physics simulation tools such as COMSOL.

• Strong analytical, problem-solving and innovative thinking skills.

• Fluent written and spoken English.

What’s on Offer

• Opportunity to work on next-generation power electronics and advanced packaging technologies.

• International, collaborative working environment with extensive knowledge sharing.

• Comprehensive training and professional development opportunities, including language courses.

• High degree of autonomy within a highly skilled and growing team.