Senior Advanced Packaging Architect (f/m/d)

Black Semiconductor; Aachen; Vor Ort; EUR 80.000 - 120.000; Vollzeit

Zusammenfassung

An innovative firm in the semiconductor industry seeks a Senior Advanced Packaging Architect to lead the design of next-generation SOCs. This role focuses on integrating advanced CMOS processes with cutting-edge photonics technology, targeting high-performance applications in data centers and edge AI. Join a team that values flexibility, personal growth, and collaboration, where your expertise will drive significant advancements in chip connectivity and efficiency. Be part of a forward-thinking organization committed to transforming the semiconductor landscape through groundbreaking graphene solutions.

Leistungen

Comprehensive benefits package

Outstanding insurance

Pension options

Virtual stock options

Continuous learning opportunities

Qualifikationen

• 10+ years of experience in semiconductor packaging with advanced techniques.
• Understanding of silicon photonics packaging and connectivity.

Aufgaben

• Design and implement advanced packaging solutions for SOCs.
• Interface with foundry and OSAT for vendor evaluation and feasibility studies.

Kenntnisse

Semiconductor Packaging

2.5D/3D Integration

System-on-Chip (SoC)

Wafer Bumping

Silicon Photonics

Mechanical/Electrical Properties

Ausbildung

Bachelor's in Electrical Engineering

Master's or PhD in relevant field

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunities. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

Your Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science is required; Master’s or PhD preferred
• 10+ years of experience in semiconductor packaging with a focus on advanced techniques such as 2.5D/3D integration, fan-out packaging, or system-on-chip (SoC) solutions
• 10+ years of experience with 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW, and Photonics
• 10+ years of experience in advanced packaging and organic substrate technology, silicon, interposer, substrate manufacturing process, assembly flow, functional and reliability test, and qualification
• 10+ years of experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle
• 10+ years of experience in understanding core and build-up material mechanical/electrical properties, trade-offs, CTE mismatch, TSV impact on warpage, stress, reliability, and Chip Package Interaction (CPI)

Other

• Understanding of current silicon photonics packaging and connectivity
• Successful customers engagement on so-architecting customer specific solutions

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what mattersLet’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal developmentYour Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and futureWe Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forwardWe connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industryCan you picture yourself in this Role and our Company? Let’s connect

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude
In short,we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

Black Semiconductor is looking for aSenior Advanced Packaging Architect (f/m/d) to join our photonics product development team. In this pivotal role, you will architect the next generation of advanced packaged SOCs incorporating advanced CMOS processes and latest photonics innovation targeting data centers and edge AI use cases
You will be responsible for designing and implementing advanced packaging solutions for high-performance heterogeneous, silicon and photonics, SOCs using chiplet architecture. You will be foundry and OSAT interface person for advanced packaging vendor evaluation, technology selection, feasibility study, design, manufacturing, assembly, test, and qualification

To join our team, you should be excited to

• Fully documented SOC Advanced Packaging Product Requirement Specification (PRS) per product that includes package design, verification, thermal/mechanical analysis, quality/reliability and estimations for performance and cost
• Fully documented advanced packaging IP roadmap aligned with our technology capabilities and OSATs
• Fully documented Customer Packaging Requirement Document (CRD) per customer engagement
• Advanced Packaging concept and feasibility documents that describe the solution space explored and recommendation on final architecture
• Fully documented advanced packaging ecosystem and competitive analysis