R&D – Head Embedded NVM Technologies

Theron Solutions; Stuttgart; Vor Ort; EUR 80.000 - 130.000; Vollzeit

Zusammenfassung

An established industry player is seeking a seasoned professional with over 15 years of experience in the semiconductor sector. This pivotal role involves integrating advanced eNVM technologies into high-volume production while managing cross-functional teams across diverse locations. You will lead projects from inception to qualification, ensuring performance and quality targets are met. This opportunity offers a dynamic work environment where innovation and collaboration are key, and your expertise will directly influence the company's technological roadmap and customer relationships.

Qualifikationen

• 15+ years of experience in the semiconductor industry.
• Proven track record in delivering technologies into volume manufacturing.

Aufgaben

• Integrate eNVM features to 28 110nm platform technologies.
• Manage end-to-end project from justification to qualification.
• Build and lead a cross-functional team across geographies.

Kenntnisse

CMOS device physics

eNVM technologies

Project Management

Analytical techniques

Cross-functional team leadership

Problem-solving skills

Ausbildung

M.S or PhD in Electrical Engineering

Materials Science or equivalent

Jobbeschreibung

THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built.

Responsibilities :

1. Integration responsibilities to add eNVM (embedded Non Volatile Memory) Features to 28 110nm platform technologies including MTP and Flash. Work with IP providers, as needed, to implement these features.
2. Design and Layout of test chips to aid in device / technology optimization, reliability assessment, and SPICE model extraction.
3. End-to-end Project Management from initial project justification to final qualification and yield ramp, with responsibilities for achieving desired performance, quality/yield, schedule, and cost targets.
4. Build and lead a cross-functional team across diverse geographies.
5. Build strong customer relationships based on confidence in the company's technical capabilities.
6. Conduct competitor benchmarking and take ownership of the technology roadmap.
7. Present to internal and customer senior executives.
8. Possible involvement in OTP development.
9. Travel (few weeks per quarter).

Qualifications :

1. M.S or PhD in Electrical Engineering, Materials Science, or equivalent.
2. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques (physical and electrical).
3. Deep understanding of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.).
4. Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.); experience in achieving competitive performance.
5. Proven track record in delivering these technologies into volume manufacturing.
6. Ability to lead cross-functional teams and achieve project completion within timeline and cost targets.
7. Ability to work across different cultures and geographies.
8. Good team player.
9. Innovation and competitive mindset.

Desired Experience Level :

1. 15+ years of experience in the semiconductor industry.
2. Proven track record of successfully developing new technologies into high-volume production.
3. Proven problem-solving skills using design of experiments and analytical tools.

EOE :

Our client is an Equal Opportunity Employer and Prohibits Discrimination and Harassment of Any Kind. We are committed to providing a work environment free of discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, national origin, sex, age, disability, HIV status, sexual orientation, gender identity, marital status, military service, family medical history, or any other protected characteristic by law.