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Process Integration Engineer (f/m/d) Wafer thinning and backside Process

Littelfuse Europe GmbH

Dortmund

Vor Ort

EUR 60.000 - 90.000

Vollzeit

Vor 7 Tagen
Sei unter den ersten Bewerbenden

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Zusammenfassung

A leading electronic components manufacturer seeks a Process Integration Engineer in Dortmund. You will lead the development of wafer processing technologies for high-power silicon IGBTs and MOSFETs, collaborating closely with design teams and mentoring junior engineers. Offering a culture of respect and collaboration, Littelfuse supports ongoing associate growth with diverse opportunities.

Leistungen

Flexible working hours
Internal Lean Six Sigma Certification

Qualifikationen

  • 3+ years of process integration experience in semiconductor manufacturing.
  • Hands-on knowledge of semiconductor device processes.
  • High communication skills in English; German is a plus.

Aufgaben

  • Lead the development of wafer processing technologies for silicon IGBTs and MOSFETs.
  • Collaborate with design and process engineering teams.
  • Mentor junior engineers and support technology transfer to manufacturing.

Kenntnisse

Process integration
Wafer thinning
Backside implantation

Ausbildung

University Degree in Semiconductor Physics or Electrical Engineering
PhD preferred

Jobbeschreibung

Littelfuse is one of America’s Best Mid-Sized Companies (Forbes) and has been named one of the Best Places to Work in Illinois (Best Companies Group) for 11 consecutive years. With its global headquarters in Chicago, Illinois, USA, Littelfuse is a leading, global manufacturer of electronic components serving more than 100,000 end customers across industrial, transportation, and electronics end markets. We have more than 17,000 employees with operations in 15 countries. From semiconductors to sensors… switches to fuses and more… we produce billions of electronic components that help our customers empower a sustainable, connected, and safer world. In 2021, Littelfuse had net sales of $2.1 billion.

Reporting to our Technology Development Manager you as Process Integration Engineer (f / m / d) Wafer thinning and backside Process will be working on the process integration and the development of High Voltage silicon IGBTs and MOSFETs. This position is located in our offices in Dortmund.

About the Position :

Lead the development and optimize of thin wafer processing technologies for high-power silicon IGBTs and MOSFETs

Collaborate closely with design and process engineering teams to define and implement processes for next-generation semiconductor devices

Interface with wafer fab to maximize production yield and ensure process stability

Serve as an internal expert, mentoring junior engineers and contributing to the growth of the internal process development team.

Support new product development and technology transfer to manufacturing

About you :

University Degree in Semiconductor Physics, Electrical Engineering or a similar field preferably a PhD

3+ years of process integration experience in a high-volume semiconductor manufacturing environment

Direct experience with wafer thinning and backside implantation / annealing / metallization processes

Hands-on knowledge and experience of semiconductor device processes and a solid understanding of semiconductor device physics and operational principles

Proven ability to mentor or supervise junior engineers

High level of written and verbal communication skills in English, German language skills are an advantage

Littelfuse strives to empower associate growth and development in a culture of ongoing collaboration and respect for diverse global perspectives and expertise.

Our Core Values – Respect, Customer Focus, Agility, Collaboration – support us in our mission to improve the safety, reliability, and performance of our customers’ products that use electrical energy.

We are an equal opportunity employer that takes pride in giving every associate the means and courage to make a difference – everywhere, every day.

We offer a variety of benefits, flexible working hours as well as development opportunities like internal Lean Six Sigma Certification.

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