Package Reliability Engineer (f/m/d)

Rozgoo; Nordrhein-Westfalen; On-site; EUR 65,000 - 105,000; Full time

Job summary

Rozgoo in Germany is seeking a Package Reliability Engineer to own the reliability of our packaged products from mission profiles to targets, collaborating with Design, Manufacturing, and OSAT partners to translate use cases into robust reliability strategies.

You will define and execute qualification plans in line with industry standards, assess failure mechanisms such as die attach, interconnect, and solder joints, and deliver data-driven recommendations to secure successful product releases.

Qualifications

• Experience in reliability engineering for electronic packages.
• Knowledge of package-level reliability concepts and failure mechanisms.
• Ability to translate product requirements into robust reliability strategies.

Responsibilities

• Own mission profiles and reliability targets for packaged products.
• Define and execute package reliability test plans (thermal, mechanical, environmental).
• Lead failure analysis and drive corrective actions.
• Provide data-driven recommendations to enable confident product release.

Skills

Reliability engineering

Package reliability

Failure analysis

Test planning

Data-driven decision making

Job description

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a Package Reliability Engineer to join our team. In this role, you will own the reliability of our packaged products, from defining mission profiles and reliability targets to identifying package-level failure mechanisms, developing qualification strategies, and making evidence-based release recommendations. Reporting to the Quality & Reliability Program Lead, you will work closely with the Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners to translate product use cases into mission profiles and FIT/MTBF targets. You will assess reliability risks, define and execute package-level reliability test plans, lead failure analysis activities, and ensure findings are driven to resolution. Your core focus will be to transform product requirements into robust reliability strategies, validate package concepts through targeted stress testing, and provide data-driven recommendations that enable confident product release. To join our team, you should be excited to: Own mission profiles and reliability targets by defining product operating conditions (temperature, voltage, humidity, thermal cycling, and lifetime requirements) and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors. Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces, including delamination, warpage, fatigue, electromigration, and optical or electrical drift. Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and custome