Package Reliability Engineer (f/m/d)

Blacksemiconductor; Aachen; Vor Ort; EUR 70.000 - 110.000; Vollzeit

Zusammenfassung

Blacksemiconductor in Aachen seeks a Package Reliability Engineer to own the reliability of packaged products, defining mission profiles, targets, and test strategies. You will collaborate with Quality & Reliability teams to translate use cases into robust reliability plans and drive failure analysis.

The role focuses on assessing risks, executing qualification plans, and delivering data-driven release recommendations for confident product launches.

Qualifikationen

• Master's degree or equivalent in Electrical Engineering or related field.
• 3–5+ years of package reliability experience with substrates, die attach, interconnects, and solder joints.
• Understanding of high-speed I/O and RF reliability, including signal integrity, jitter, and eye closure over product lifetime.
• Solid foundation in reliability engineering, including FIT and MTBF calculations and mission profile development.
• Experience with photonics reliability is highly desirable.

Aufgaben

• Own mission profiles and reliability targets by defining operating conditions and targets across package, interconnect, and device levels.
• Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical interfaces.
• Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing.
• Lead technical interface with OSATs, substrate suppliers, and labs, reviewing data and challenging results when evidence is insufficient.
• Drive root-cause investigations using X-ray, SEM/EDX, cross-sectioning, and related methods; translate findings into CAPA actions.
• Develop risk-based qualification strategies for novel packaging technologies like UBC and optical interconnects.
• Provide data-driven release recommendations by assessing readiness for sampling, milestones, or production release.

Kenntnisse

Package reliability

Semiconductor packaging

High-speed I/O & RF reliability

Reliability fundamentals

Ausbildung

Master's degree in Electrical Engineering or related field

Materials Science

Microelectronics

Reliability Engineering

Equivalent experience

Tools

X-ray

C-SAM

Cross-sectioning

SEM/EDX

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude

In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a Package Reliability Engineer to join our team. In this role, you will own the reliability of our packaged products, from defining mission profiles and reliability targets to identifying package-level failure mechanisms, developing qualification strategies, and making evidence-based release recommendations.

Reporting to the Quality & Reliability Program Lead, you will work closely with the Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners to translate product use cases into mission profiles and FIT/MTBF targets. You will assess reliability risks, define and execute package-level reliability test plans, lead failure analysis activities, and ensure findings are driven to resolution.

Your core focus will be to transform product requirements into robust reliability strategies, validate package concepts through targeted stress testing, and provide data-driven recommendations that enable confident product release.

To join our team, you should be excited to:

• Own mission profiles and reliability targets by defining product operating conditions (temperature, voltage, humidity, thermal cycling, and lifetime requirements) and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors.
• Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces, including delamination, warpage, fatigue, electromigration, and optical or electrical drift.
• Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and customer-specific requirements.
• Lead the technical interface with OSATs, substrate suppliers, and labs, defining reliability requirements, reviewing data, and challenging results when the supporting evidence is insufficient or unrepresentative.
• Drive root-cause investigations and failure analysis, leveraging techniques such as X-ray, C-SAM, cross-sectioning, SEM/EDX, and related methods, and translate findings into CAPA/8D actions, design improvements, and requalification decisions.
• Develop risk-based qualification strategies for novel packaging technologies, such as UBC and optical interconnects, where industry standards are incomplete or do not yet exist.
• Provide data-driven release recommendations by assessing whether products are ready for customer sampling, qualification milestones, or production release, while clearly communicating any remaining reliability risks.

Your Qualifications

• Educational background with a Master's degree (or equivalent experience) in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or a related field.
• Package reliability expertise with 3–5+ years of experience evaluating semiconductor package construction (substrates, die attach, interconnects, and solder joints) and understanding the failure mechanisms associated with these technologies.
• Understanding of high-speed I/O and RF reliability, including how reliability degradation impacts high-speed serial, RF, and optical interfaces (e.g., signal integrity, insertion loss, jitter, and eye closure over product lifetime). This expertise goes beyond conventional digital logic reliability and is a core requirement for this role. Experience with photonics reliability is highly desirable.
• Solid foundation in reliability engineering, including FIT and MTBF calculations, mission profile development, acceleration models, and translating product use cases into measurable reliability requirements and targets.
• …