Lead System Engineer (m/f/x)

ZEISS Group; Oberkochen; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

ZEISS Group in Germany seeks a senior system engineer to own fully automated FIB-SEM process flows and 3D tomography tooling for semiconductor wafers. You will define automation concepts, drive architecture across mechanics, electronics, and software, and translate customer use cases into concrete system requirements.

Collaborate with application engineering, product management, and the Lead Software Architect to ensure robust hardware–software co-development, closed-loop control, and scalable

Qualifikationen

• Degree in mechanical engineering, mechatronics, physics or related field.
• PhD is advantageous.
• Experience in automated process flows for complex tools.

Aufgaben

• Take technical ownership of automated FIB-SEM process flows and translate into system requirements.
• Define overall automation concept and workflow strategy.
• Lead system and machine design across mechanics, electronics, software, and controls.
• Drive design and implementation of automated process modules and their interaction.
• Establish system-level test and validation strategy.
• Collaborate with Lead Software Architect to align hardware–software co-development.
• Coordinate interdisciplinary development and stakeholder alignment.

Kenntnisse

Automation architecture

System engineering

Cross-functional collaboration

Analytical thinking

FIB/SEM knowledge

3D tomography workflows

Ausbildung

Bachelor's degree in mechanical engineering, mechatronics, physics or related field

PhD (advantageous)

Tools

Programming and automation frameworks

Electronic/measurement instrumentation

Jobbeschreibung

ZEISS Semiconductor Manufacturing TechnologyEnabler for smaller, more powerful, and more energy-efficient microchipsWorking for tomorrow today.Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.Your RoleTake technical ownership of the development of fully automated FIB-SEM process flows and process modules, and translate them into system requirements for a novel FIB-SEM based 3D-Tomography inspection and metrology tool for semiconductor wafers.Define the overall automation and process concept (workflow orchestration, recipe strategy, tool states, error handling, recovery concepts) in close alignment with application engineering and customer use casesLead system and machine/tool design, requirements definition, and architecture across mechanics, process modules, electronics, software, controls, sensors, and infrastructureDrive the design and implementation of automated process modules and their robust interaction across the complete process chainDefine and maintain the system requirements specification, interface descriptions, and system-level test and validation strategy in close collaboration with product management and technical expertsWork in close collaboration with the Lead Software Architect to enable efficient hardware–software co-development, ensuring that control concepts, automation architecture, process and data flows are optimally aligned across all layersEstablish system-level strategies for closed-loop control and monitoring (metrology feedback, sensor fusion, drift compensation) to achieve repeatable automated processing at scaleCoordinate interdisciplinary development between system engineers, product developers, project management, and key stakeholdersEnsure system performance targets (resolution, throughput, stability, availability, reliability) are translated into clear technical requirements and verified by suitable test conceptsGuide feasibility studies, concept evaluations, and trade-off analyses for critical subsystems, interfaces, and automation concepts. Assess and mitigate technical risks, manage change requests, and ensure end-to-end traceability from customer use cases to realized automated functionsAct as the technical contact person for the product within the project, representing system engineering in reviews, design boards, and customer discussionsFoster a culture of technical excellence, collaboration, and continuous improvement within the system engineering communityYour ProfileA very well-completed degree in mechanical engineering, mechatronics, physics, physical engineering, or a comparable field and several years of professional experience; a PhD is advantageousProven experience in developing automated process flows and/or process modules for complex tools or machines (ideally in semiconductor manufacturing, inspection, or metrology environments)Experience in electron microscopy; ideally also in FIB technology and 3D tomography related workflowsExperience in product development of complex systems and machines (incl. requirements engineering, interface management, verification/validation); ideally in the semiconductor environmentProfound knowledge in system architecture and the development of modular solutions, with a strong understanding of automation, controls, and end-to-end process integrationStrong analytical thinking, systematic working methods, and problem-solving skills— especially in troubleshooting complex automated process chainsAbility to collaborate and communicate cross-functionally with various stakeholders (application, software, hardware, manufacturing, service, and customers)Knowledge of programming languages, software development, and/or data/automation frameworks is an advantageWillingness to work in a highly dynamic work environmentVery good English skillsWillingness to travelYour ZEISS Recruiting Team:Georgios Tanoglou