Integrated Photonics Packaging Engineer (f/m/d)

Black Semiconductor; Aachen; Vor Ort; EUR 60.000 - 100.000; Vollzeit

Zusammenfassung

An established industry player is seeking an Integrated Photonics Packaging Engineer to innovate optical interconnects. This role involves designing efficient optical I/O modules and collaborating with various teams to optimize prototypes for manufacturability and reliability. You will have the opportunity to make a significant impact in the semiconductor industry by developing cutting-edge technologies that enhance connectivity and performance. Join a dynamic team that values creativity and problem-solving, and be part of a mission to transform the future of technology through innovative solutions.

Leistungen

Comprehensive benefits package

Outstanding insurance

Pension options

Virtual stock options

Continuous learning opportunities

Qualifikationen

• 5+ years in opto-mechanical packaging or 2+ years with PhD.
• Hands-on experience with packaging and laser integration.

Aufgaben

• Lead development of next-gen optical interconnects.
• Collaborate with vendors and design optimal interfaces.

Kenntnisse

Opto-mechanical packaging solutions

Collaboration skills

Communication skills

Optical transmission analysis

Hands-on experience with laser integration

Ausbildung

Master’s degree in relevant technical field

Tools

Opto-mechanical simulation software

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects.

Your Qualifications

• Master’s degree or above in a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar discipline)
• 5+ years of experience (or 2+ years with relevant PhD) in opto-mechanical packaging solutions, such as Silicon Photonics, Co-packaged Optics, Optical Transceivers or related fields
• Working experience with 2D, 2.5D or 3D packaging solutions and photonics integration
• Hands-on experience with packaging and laser integration
• Practical experience using opto-mechanical simulation software tools (optical transmission, strain/stress, heat transfer analysis)
• Excellent collaboration and communication skills for working with colleagues, partners, customers, and consultants
• Experience in photonic passive design is a plus

Other

• Willingness to work on designs, support characterization, and engage with vendors (including occasional travel)
• Reliable, independent, and proactive working style with a creative, solution-oriented mindset
• Excellent communication skills in English

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters.

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development.

Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future.

We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward.

We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry. Can you picture yourself in this Role and our Company? Let’s connect.

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude. In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution.

The Role

Black Semiconductor GmbH is currently looking for an Integrated Photonics Packaging Engineer (f/m/d) to lead the development of next-generation optical interconnects. This role focuses on designing and producing efficient optical I/O modules, from concept to volume production, while meeting performance, reliability, manufacturability, yield, and cost requirements. These Optical I/O modules could be a stand-alone device or a part of a larger advanced package. You will collaborate with vendors and OSATs, evaluate different laser sources and packaging solutions, and work alongside our photonic design team to design and simulate optimal PIC-to-fiber coupling interfaces for multi-lane optical connections. Additionally, you will be responsible for building and testing prototypes, contributing to the development of our cutting-edge technologies. The position seeks highly motivated individuals who thrive in ambiguity and enjoy working in a small dynamic team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology.

To join our team, you should be excited to

• Develop & innovate a customized I/O packaging concept
• Define optical, mechanical and thermal specifications
• Optimize assemblies for manufacturability and reliability
• Select a laser source (first year)
• Collaborate with internal team members of Design, Fabrication Process & Characterization, as well as with external vendors and OSATs to build an integrated Photonics packaging prototype with user acceptance
• Test I/O module prototype and strive to continuously improve it
• Contribute to system-level optimization and product strategy
• Be motivated by making the world a better place through technology and wanting to be part of a team that makes this happen