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QuantumDiamonds GmbH, headquartered in Munich, Germany, invites an experienced Inline Metrology Discovery Lead to join our team. You will work directly with major foundries, IDMs and OSATs to identify inline use cases, convert them into precise statements, and secure samples and defect context to validate fit or failure in both pre-bonding and post-bonding stages.
You will manage a small multidisciplinary team from day one and grow it into the inline applications organization as the product
Our technology is state of the art in lab environments today, with units installed in Taiwan, the United States and Europe. We have demonstrated the capability of quantum sensing on HBM4 stacks and on the most recent CoWoS structures, providing technical guidance where established methods reached their limits. Now we are bringing that capability into the fab, at wafer level and in high-volume manufacturing environments. The first inline use cases are identified, and more are coming.
As Inline Metrology Discovery Lead, you will work directly with leading foundries, IDMs and OSATs to find additional cases where magnetic field imaging solves a yield problem that no existing inspection method can, both pre-bonding and post-bonding. You turn the existing broad customer interest into precise, testable problem statements, secure the samples and defect context needed to prove or disprove fit, and rank the opportunities so that our engineering effort goes to the use cases that matter.
This is a technically grounded, decision-owning role at the front end of our inline product strategy, reporting to our Head of Pre-Development. You lead a small multidisciplinary team from day one, application engineers, data scientists and lab technicians, and you grow it into the inline applications organisation as the product matures. You do not need to arrive as a quantum sensing expert. You need to know high-volume manufacturing and inspection or metrology tooling deeply, you know how to get the best from a mixed team of engineers and scientists, and you want to be the person who decides what this technology becomes in the fab.
Our technology is state of the art in lab environments today, with units installed in Taiwan, the United States and Europe. We have demonstrated the capability of quantum sensing on HBM4 stacks and on the most recent CoWoS structures, providing technical guidance where established methods reached their limits. Now we are bringing that capability into the fab, at wafer level and in high-volume manufacturing environments. The first inline use cases are identified, and more are coming.
As Inline Metrology Discovery Lead, you will work directly with leading foundries, IDMs and OSATs to find additional cases where magnetic field imaging solves a yield problem that no existing inspection method can, both pre-bonding and post-bonding. You turn the existing broad customer interest into precise, testable problem statements, secure the samples and defect context needed to prove or disprove fit, and rank the opportunities so that our engineering effort goes to the use cases that matter.
This is a technically grounded, decision-owning role at the front end of our inline product strategy, reporting to our Head of Pre-Development. You lead a small multidisciplinary team from day one, application engineers, data scientists and lab technicians, and you grow it into the inline applications organisation as the product matures. You do not need to arrive as a quantum sensing expert. You need to know high-volume manufacturing and inspection or metrology tooling deeply, you know how to get the best from a mixed team of engineers and scientists, and you want to be the person who decides what this technology becomes in the fab.
Founded in 2022 as a spin-off of TU Munich, QD leverages quantum sensors to rapidly capture three-dimensional current maps within multi-layer chips. Our strong, international team of over 70, including physicists, engineers, data scientists, and other experts, works side by side with major semiconductor manufacturers, supporting chip debugging and accelerating yield analysis. Backed by top-tier deep tech investors, semiconductor experts, and strategic public programmes, we have ensured long-term stability, shifting from breakthrough to scale - and shaping the next chapter in chip testing.
Founded in 2022 as a spin-off of TU Munich, QD leverages quantum sensors to rapidly capture three-dimensional current maps within multi-layer chips. Our strong, international team of over 70, including physicists, engineers, data scientists, and other experts, works side by side with major semiconductor manufacturers, supporting chip debugging and accelerating yield analysis. Backed by top-tier deep tech investors, semiconductor experts, and strategic public programmes, we have ensured long-term stability, shifting from breakthrough to scale - and shaping the next chapter in chip testing.
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QuantumDiamonds GmbH, headquartered in Munich, Germany, develops and manufactures semiconductor inspection systems based on quantum sensing. Spun out of the Technical University of Munich in 2022, the company uses nitrogen-vacancy centers in diamond to map electrical current with micrometer precision inside advanced 2.5D and 3D chip architectures. Nine of the world's ten largest semiconductor manufacturers are engaged with QuantumDiamonds, with systems deployed across Europe, the United States, and Asia. The company is investing €152 million to build the world's first production facility for quantum sensing-based semiconductor inspection tools, supported under the European Chips Act.