Head of Packaging (m/f/d)

Q.ANT; Baden-Württemberg; On-site; EUR 120,000 - 180,000; Full time

Job summary

Q.ANT is building photonic processing systems that compute with light and aims to deliver energy-efficient AI hardware. The Head of Packaging leads a new CPO Packaging Team, owning architecture and supplier strategy from concept to high-volume production.

You will bridge internal chip design with external OSAT partners, drive DFM, and ensure reliability and scalable packaging solutions for next-generation photonic/electronic assemblies.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or closely related field.
• 5+ years in Semiconductor Packaging/OSAT with global supplier experience.
• Hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment, and advanced packaging materials.

Responsibilities

• Build and scale a CPO Packaging team; lead hiring and capability development.
• Oversee evaluation and management of global OSAT partners and onboard qualified CPO suppliers.
• Drive development of co-packaged photonic/electronic assemblies and manage thermal and materials challenges.
• Implement DFM guidelines and ensure reliability qualification per JEDEC and Telcordia.
• Coordinate with Chip Design, Systems, Manufacturing, Test, and supply chain for successful NPI and volume production.
• Lead root-cause analysis using 8D, FMEA, and Ishikawa to resolve issues.

Skills

Leadership

OSAT Mastery

Technical ownership

DFM

Cross-functional collaboration

Engineering quality

Analytical mindset

Communication

Education

Electrical Engineering / Materials Science / Physics degree

Tools

Co-Packaged Optics (CPO) packaging

Job description

The future of AI computing is light, not electrons.

Q.ANT is building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As our Head of Packaging, you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.

Your Responsibilities

• Leadership & Team Architecture: Build, mentor, and disciplinarily lead a high-performing CPO Packaging engineering team; execute gap analyses and strategic hiring to accelerate our scaling roadmap.
• OSAT & Supply Chain Mastery: Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.
• Technical Ownership (CPO & Fiber Attach): Drive the development of advanced co-packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high-performance thermal management.
• Design for Excellence (DFM): Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.
• Cross-Functional Synergy: Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out.
• Continuous Engineering Quality: Champion rigorous root-cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations.

Your profile

• Academic Foundation: You hold a Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
• Semiconductor & OSAT Expertise: You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.
• CPO & Precision Hands-on Skills: You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).
• Leadership & Empowerment: You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.
• Analytical Self-Leadership: You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.
• Communication Excellence: You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders.

Why us?

• We hire for attitude and train for skills.
• We encourage self-responsibility and accelerate professional development.
• We move fast and encourage experimentation.
• You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
• You can be part of a passionate international, highly skilled cross-functional team.
• You will have access to the founders of the company.