Failure Analysis Engineer – Microscopy & Materials (m/f/d)

ESMC; Dresden; Vor Ort; EUR 55.000 - 85.000; Vollzeit

Zusammenfassung

ESMC in Dresden is seeking a Failure Analysis Engineer to lead the setup of a new FA lab, install and validate analytical instruments, and run advanced microscopy to analyze defect samples supporting production tool qualifications.

The role requires a materials science/engineering background and hands-on microscopy experience, with flexibility for weekend/holiday standby in a fast-paced international startup environment.

Qualifikationen

• Education: Bachelor’s or Master’s degree in Material Science, Physics, Nanotechnology, Electrical/Chemical Engineering, or a related field.
• Hands-on experience with advanced microscopy tools (SEM, TEM, FIB) for sample analysis.
• Structured, detail-oriented analytical mindset with troubleshooting skills.
• Fluent English (written and spoken).
• Willingness to support occasional weekends/holidays.

Aufgaben

• Lab Establishment: Lead the physical setup of the local Dresden FA Lab, including installation, qualification, and initial calibration of advanced analytical instruments.
• Physical Failure Analysis: Apply hands-on expertise using advanced microscopy and sputtering systems (TEM, SEM, FIB) for high-resolution sample characterization.
• Root-Cause Investigation: Support fab engineers in diagnosing defect, yield, and reliability issues with timely analyses.
• Team Coordination: Train and guide FA lab technicians in sample preparation, monitoring, and continuous improvement tasks.
• Process Improvement: Document local knowledge on material structures, defect physics, and failure mechanisms.
• Production Continuity: Provide on-duty lab coverage during holidays and occasional weekend overtime.

Kenntnisse

Microscopy operation

Problem solving

English fluency

Team collaboration

Ausbildung

Bachelor’s or Master’s degree in Materials Science, Physics, Nanotechnology, Electrical/Chemical Engineering

Tools

SEM

TEM

FIB

Jobbeschreibung

European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation semiconductor products. ESMC represents a shared commitment to strengthening the European semiconductor ecosystem.

For our future fab in Dresden, we are looking for a highly motivated and committed:

Are you passionate about investigating the microscopic root causes of complex technical challenges? As a Failure Analysis Engineer (m/f/d) at ESMC, you will be the lead detective of our semiconductor fabrication facility in Dresden.

*Starting on January 2027*, you will drive the exciting greenfield setup of our brand-new local FA laboratory - overseeing the move-in, installation, and qualification of cutting-edge analytical equipment. Once operational, you will run advanced electron microscopes to analyze defect samples, support production tool qualifications, and troubleshoot process issues.

This is a unique opportunity to blend high-level material science with practical, hands-on diagnostics to maximize the reliability of our products!

Job Responsibilities

• Lab Establishment: Lead the physical setup of the local Dresden FA Lab, including the installation, qualification, and initial calibration of advanced analytical instruments.
• Physical Failure Analysis: Apply hands-on expertise using advanced microscopy and sputtering systems (including TEM, SEM, and FIB) to perform high-resolution sample characterization.
• Root-Cause Investigation: Support fab engineers in diagnosing defect, yield, and reliability failures by providing timely, high-quality sample analyses.
• Team Coordination: Train and functionally guide FA lab technicians in running routine sample preparation, standard monitoring, and continuous improvement tasks.
• Process Improvement: Build and document specialized local knowledge regarding material structures, defect physics, and packaging failure mechanisms.
• Production Continuity: Deliver on-duty laboratory coverage during holidays and occasional planned weekend overtime (approximately once per month) to support critical production issues.

Job Qualifications

Must-Have

• Education: Bachelor’s or Master’s degree in Material Science, Physics, Nanotechnology, Electrical/Chemical Engineering, or a related scientific discipline.
• Hands-on Experience: Minimum of 1 year of practical experience operating advanced microscopy tools (such as SEM, TEM, or FIB). Note: Relevant master’s thesis work, university research projects, or internships will be fully considered for ambitious fresh graduates.
• Problem-Solving Mindset: A structured, detail-oriented approach to analysis with a passion for troubleshooting and technical forensics.
• Languages: Fluency in English (written and spoken) is required.
• Flexibility: Adaptability to evolving tasks in a dynamic startup/greenfield environment, and a readiness to support occasional weekend/holiday standby shifts.

Nice-to-Have

• Prior experience in semiconductor failure analysis, wafer manufacturing, or cleanroom environments.
• Knowledge of basic chemistry/etching processes for physical sample preparation.
• Basic communication skills in German and/or Mandarin.

Why Join ESMC?

• Help build a completely new semiconductor manufacturing site in Europe.
• Work in a highly international environment with colleagues across Europe, Taiwan and the US.
• Shape processes instead of maintaining existing structures.
• Participate in global projects and cross-functional collaboration.
• International onboarding including 3-6 months of training in Taiwan.

Each journey starts with a first step.

Joining ESMC at this early stage will provide you with the unique opportunity to actively shape the future of the fab in Dresden, boost your career and put your true potential to the test. You will be working in a fast paced, international startup environment whilst at the same time having access to the experience, talent, and resources of the largest and most advanced semiconductor manufacturer in the world, TSMC. You have ample opportunities to learn about TSMC Operations, Digital Transformation, and various advanced Facilities related topics, both in Taiwan and other sites around the world.

Behind the world’s most advanced technology are real people with real passion. Our success is fueled by our core values: Integrity, Commitment, Innovation and Customer Trust (ICIC).

At ESMC we believe in the power of inclusive leadership and passion. We demonstrate this in our commitment to our people vision: create an inclusive environment to inspire passion and enable the best in YOU.

It is the policy of ESMC to provide equal employment opportunity (EEO) to all persons regardless of age, color, ethnic and national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law.