Failure Analysis Engineer – Microscopy & Materials (m/f/d)

TSMC - Taiwan Semiconductor Manufacturing Company Limited

Dresden

Vor Ort

EUR 65.000 - 90.000

Vollzeit

Vor 3 Tagen
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Zusammenfassung

ESMC in Dresden seeks a Failure Analysis Engineer for Microscopy & Materials to lead the greenfield FA laboratory setup, move-in, installation, and qualification of analytical equipment.

You will operate advanced electron microscopes to analyze defect samples, support production tool qualifications, and troubleshoot process issues, blending material science with practical diagnostics to maximize product reliability.

Qualifikationen

  • Bachelor’s or Master’s degree in Material Science, Physics, Nanotechnology, Electrical/Chemical Engineering, or a related scientific discipline.
  • Minimum of 1 year of practical experience operating advanced microscopy tools (SEM, TEM, or FIB).
  • Structured, detail-oriented approach to analysis with a passion for troubleshooting and technical forensics.
  • Fluency in English (written and spoken) is required.
  • Adaptability to evolving tasks in a startup/greenfield environment and readiness to support standby shifts.

Aufgaben

  • Lead the greenfield setup of the local FA laboratory, including move-in, installation and qualification of analytical equipment.
  • Operate advanced electron microscopes to analyze defect samples and support production tool qualifications.
  • Troubleshoot process issues and drive root-cause analysis in collaboration with cross-functional teams.
  • Blend high-level material science with practical diagnostics to maximize product reliability.

Kenntnisse

Microscopy operation
Problem-solving mindset
English communication

Ausbildung

Bachelor’s or Master’s degree in Material Science/Physics/Nanotechnology/Engineering

Tools

SEM
TEM
FIB

Jobbeschreibung

Failure Analysis Engineer – Microscopy & Materials (m/f/d)


Are you passionate about investigating the microscopic root causes of complex technical challenges? As a Failure Analysis Engineer (m/f/d) at ESMC, you will be the lead detective of our semiconductor fabrication facility in Dresden.


*Starting on January 2027*, you will drive the exciting greenfield setup of our brand-new local FA laboratory – overseeing the move-in, installation, and qualification of cutting‑edge analytical equipment. Once operational, you will run advanced electron microscopes to analyze defect samples, support production tool qualifications, and troubleshoot process issues.


This is a unique opportunity to blend high-level material science with practical, hands‑on diagnostics to maximize the reliability of our products!


Must-Have:


  • 1. Education: Bachelor’s or Master’s degree in Material Science, Physics, Nanotechnology, Electrical/Chemical Engineering, or a related scientific discipline.

  • 2. Hands‑on Experience: Minimum of 1 year of practical experience operating advanced microscopy tools (such as SEM, TEM, or FIB). Note: Relevant master's thesis work, university research projects, or internships will be fully considered for ambitious fresh graduates.

  • 3. Problem‑Solving Mindset: A structured, detail‑oriented approach to analysis with a passion for troubleshooting and technical forensics.

  • 4. Languages: Fluency in English (written and spoken) is required.

  • 5. Flexibility: Adaptability to evolving tasks in a dynamic startup/greenfield environment, and a readiness to support occasional weekend/holiday standby shifts.


Nice-to-Have:


  • 1. Prior experience in semiconductor failure analysis, wafer manufacturing, or cleanroom environments.

  • 2. Knowledge of basic chemistry/etching processes for physical sample preparation.

  • 3. Basic communication skills in German and/or Mandarin.


Why Join ESMC?


  • 1. Help build a completely new semiconductor manufacturing site in Europe.

  • 2. Work in a highly international environment with colleagues across Europe, Taiwan and the US.

  • 3. Shape processes instead of maintaining existing structures.

  • 4. Participate in global projects and cross‑functional collaboration.

  • 5. International onboarding including 3–6 months of training in Taiwan.

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