Quality Engineer – Outgoing Quality Assurance (OQA) (m/f/d)

TSMC - Taiwan Semiconductor Manufacturing Company Limited

Dresden

Vor Ort

EUR 60.000 - 90.000

Vollzeit

14 Tage+
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Zusammenfassung

ESMC in Dresden is hiring a Quality Engineer for Outgoing Quality Assurance. You will establish the local OQA site, develop automated workflows, and manage advanced inspection tools and testing recipes in a greenfield setting.

You will combine defect analysis with big data analytics to minimize defects and risk, collaborating with fab teams. German language skills are beneficial for site operations.

Qualifikationen

  • Bachelor’s or Master’s degree in Mechanical, Electrical, or Materials Engineering, Physics, Quality/Reliability, or a related field.
  • 0–3 years of hands-on professional experience within semiconductor manufacturing, quality and reliability engineering, process integration, yield, or packaging/bumping/assembly.

Aufgaben

  • Lead the establishment of the local OQA site operations in Dresden.
  • Develop automation workflows and manage inline inspection tools and testing recipes.
  • Utilize defect analysis and big data analytics to minimize defects and quality risks.

Kenntnisse

Defect inspection
Recipe creation
Failure analysis
SPC
English
Ownership
Python
SQL

Ausbildung

BSc/MSc in Eng/Physics

Tools

JMP
SQL
Python

Jobbeschreibung

Quality Engineer – Outgoing Quality Assurance (OQA) (m/f/d)


Are you ready to be the ultimate gatekeeper of quality for Europe’s newest, most advanced semiconductor facility? As a Quality Engineer (m/f/d) in Outgoing Quality Assurance (OQA) at ESMC, you will be responsible for ensuring our products meet the highest standards before they reach our customers.


*Starting from January 2027* and based in Dresden, you will lead the establishment of our local OQA site operations, develop automation workflows, and manage advanced inline inspection tools and testing recipes.


By combining hands‑on technical defect analysis with big data analytics, you will collaborate closely with the fab manufacturing teams to minimize defect rates and mitigate quality risks in a dynamic greenfield environment!


Must-Have:


  • 1. Education: Bachelor’s or Master’s degree in Mechanical, Electrical, or Materials Engineering, Physics, Quality/Reliability, or a related science/engineering field.

  • 2. Experience: 0 to 3 years of hands‑on professional experience within semiconductor manufacturing, quality and reliability engineering, process integration, yield, or packaging/bumping/assembly.

  • 3. Technical Knowledge: Initial experience with defect density inspection tools, recipe creation, failure analysis methods, or statistical process control (SPC).

  • 4. Languages: Fluent in written and spoken English.

  • 5. Personal Attributes: Highly motivated with strong ownership, resilience under pressure, and a proactive, collaborative approach to solving complex problems.


Nice-to-Have:


  • 1. Familiarity with big data analysis software, scripting languages, or statistical tools (e.g., JMP, SQL, or Python).

  • 2. Basic conversational communication skills in German and/or Mandarin.


Why Join ESMC?


  • 1. Help build a completely new semiconductor manufacturing site in Europe.

  • 2. Work in a highly international environment with colleagues across Europe, Taiwan and the US.

  • 3. Shape processes instead of maintaining existing structures.

  • 4. Participate in global projects and cross‑functional collaboration.

  • 5. International onboarding including approximately 9-12 months of training in Taiwan.

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