Expert in Substrate Cutting & Polishing Process (f/m/d)

Bertrandt; München; Vor Ort; EUR 60.000 - 80.000; Vollzeit

Zusammenfassung

A leading engineering consultancy in Munich is seeking an expert in Substrate Cutting & Polishing Process to lead the development and execution of projects. You will be responsible for manufacturing processes for SiC power components, ensuring quality and productivity. Candidates should have a degree in semiconductor physics and at least 10 years of relevant experience. Proficiency in English is essential, with knowledge of German or Chinese being a plus. This role offers flexible working hours and attractive compensation.

Leistungen

Flexible working hours

Attractive compensation

Networking opportunities

Qualifikationen

• 10+ years in cutting and polishing semiconductor substrates.
• Practical experience in SiC product introduction.
• Familiarity with semiconductor processing techniques.

Aufgaben

• Lead manufacturing processes for SiC power components.
• Monitor and track engineering processes.
• Analyze process data and derive corrective actions.

Kenntnisse

Process development

Material evaluation

Expertise in semiconductor physics

Communication skills (English)

Ausbildung

Degree in semiconductor physics or related field

Jobbeschreibung

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Expert in Substrate Cutting & Polishing Process (f/m/d), Munich

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Job Category: Other

EU work permit required: Yes

Job Reference: 6875ed2bd86d

Job Views: 2

Posted: 26.08.2025

Expiry Date: 10.10.2025

Job Description:

What to expect:

• You will be responsible for the development and execution of projects in the field of cutting and polishing SiC substrates.
• Within your area of responsibility, you will lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases.
• Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues.
• You will become an expert in product reliability requirements, testing methods, and evaluations.
• Your daily focus will be on increasing productivity and tackling major challenges.

What you bring along:

• Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry.
• At least 10 years of experience in the introduction or development of processes for cutting and polishing semiconductor substrates.
• Practical experience in the introduction or production of SiC products in fabs is required.
• You are proficient in measurement methods and techniques for evaluating materials and process results.
• Ideally, you are already familiar with the SiC process flow, manufacturing processes, and characterization techniques, and have extensive expertise in semiconductor material processing, preferably in the development of power components.
• Experience in the mass production of semiconductor technology is advantageous.
• Your hands-on mentality and open attitude towards intercultural work environments make it easy for you to quickly adapt to new environments.
• In addition to excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous.

What we offer: Responsible Tasks, Flexible working hours, Networking throughout the group, Attractive compensation, Team-oriented work.