Expert in Substrate Cutting & Polishing Process (f/m/d)

TN Germany; München; Vor Ort; EUR 80.000 - 120.000; Vollzeit

Zusammenfassung

An established industry player is seeking an expert in substrate cutting and polishing processes in Munich. This role involves leading projects in semiconductor manufacturing, focusing on SiC substrate processes. With a strong emphasis on quality and productivity, you'll ensure smooth operations during production phases while tackling engineering challenges. The ideal candidate will have extensive experience in semiconductor processes and excellent communication skills. Join a dynamic team offering flexible hours and attractive compensation, where your expertise will drive innovation in the semiconductor industry.

Leistungen

Flexible working hours

Attractive compensation

Team-oriented work

Networking throughout the group

Qualifikationen

• 10+ years of experience in cutting and polishing semiconductor substrates.
• Familiar with SiC process flow and manufacturing processes.

Aufgaben

• Lead manufacturing processes for SiC power components.
• Monitor engineering processes and derive corrective actions.

Kenntnisse

Proficient in measurement methods

Expertise in semiconductor material processing

Excellent communication skills in English

Knowledge of German and/or Chinese

Hands-on mentality

Ausbildung

Studies in semiconductor physics

Materials science

Chemistry

Jobbeschreibung

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Expert in Substrate Cutting & Polishing Process (f/m/d), Munich

Job Details

Client: [Client information not provided]

Location: Munich

Job Category: Other

EU work permit required: Yes

Job Reference: 6875ed2bd86d

Job Views: 1

Posted: 03.05.2025

Expiry Date: 17.06.2025

Job Description

What to expect:

• You will be responsible for the development and execution of projects in the field of cutting and polishing SiC substrates.
• Within your area of responsibility, you will lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases.
• Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues.
• You will become an expert in product reliability requirements, testing methods, and evaluations.
• Your daily focus will be on increasing productivity and tackling major challenges.

What you bring along:

• Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry.
• At least 10 years of experience in the introduction or development of processes for cutting and polishing semiconductor substrates.
• Practical experience in the introduction or production of SiC products in fabs is required.
• You are proficient in measurement methods and techniques for evaluating materials and process results.
• Ideally, you are already familiar with the SiC process flow, manufacturing processes, and characterization techniques, and have extensive expertise in semiconductor material processing, preferably in the development of power components.
• Experience in the mass production of semiconductor technology is advantageous.
• Your hands-on mentality and open attitude towards intercultural work environments make it easy for you to quickly adapt to new environments.
• In addition to excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous.

What we offer:

• Responsible Tasks
• Flexible working hours
• Networking throughout the group
• Attractive compensation
• Team-oriented work