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Expert Dicing/Thinning Process (f/m/d)

Bertrandt

München

Vor Ort

EUR 70.000 - 100.000

Vollzeit

Vor 2 Tagen
Sei unter den ersten Bewerbenden

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Zusammenfassung

A leading company in semiconductor technology is seeking an Expert in Dicing/Thinning Processes in Munich. The role involves leading the development of SiC power components and enhancing manufacturing processes. Candidates should possess extensive experience in semiconductor physics and demonstrate effective communication skills in English, with knowledge of German or Chinese being a plus.

Leistungen

Flexible working hours
Attractive compensation
Team-oriented work
Networking opportunities

Qualifikationen

  • 10+ years of experience in development of dicing and thin-film processes.
  • Experience in SiC product production required.
  • Familiarity with semiconductor material processing preferred.

Aufgaben

  • Develop SiC dicing and thin-film processes.
  • Lead manufacturing process development for SiC components.
  • Monitor engineering processes and derive corrective actions.

Kenntnisse

Measurement methods for evaluating materials
Process results evaluation techniques
Communication skills in English
Cross-cultural adaptability

Ausbildung

Studies in semiconductor physics
Studies in microelectronics
Studies in materials science
Studies in chemistry

Jobbeschreibung

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Expert Dicing/Thinning Process (f/m/d), Munich

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Client:
Location:
Job Category:

Other

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EU work permit required:

Yes

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Job Reference:

0332b48c1d13

Job Views:

4

Posted:

27.06.2025

Expiry Date:

11.08.2025

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Job Description:

What to expect:

  • You will be responsible for the development of SiC dicing and thin-film processes as well as for carrying out project-related tasks

  • Within your area of responsibility, you will lead the development of the manufacturing process for SiC power components, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases

  • Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This also includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues

  • You will become an expert in reliability requirements/assessments and testing methods in your field

  • Your daily focus will be on improving product yield and tackling major challenges

  • What you bring along:
  • Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry

  • At least 10 years of experience in the introduction or development of dicing and thin-film processes for semiconductors

  • Practical experience in the introduction or production of SiC products in fabs is required

  • You are proficient in measurement methods and techniques for evaluating materials and process results

  • Ideally, you are already familiar with the SiC process flow, the manufacturing process, and characterization techniques and have extensive expertise in semiconductor material processing, preferably in the development of power components

  • Good knowledge in the field of mass production of semiconductor technology is advantageous

  • Your hands-on mentality and open attitude towards intercultural work environments make it easy for you to quickly adapt to new environments

  • In addition to excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous

  • Flexibility and openness to international business trips or delegations complete your profile

  • What we offer:Responsible Tasks Flexible working hours Networking throughout the group Attractive compensation Team-oriented work Responsible Tasks Flexible working hours Networking throughout the group Attractive compensation Team-oriented work

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