Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer (f/m/d)

Black Semiconductor GmbH; Aachen; On-site; EUR 90,000 - 120,000; Full time

Job summary

Black Semiconductor GmbH is seeking an experienced Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer to take ownership of the complete tape-out flow for our graphene photonics platform. You will drive GDS/MDP integration, DRC/LVS/ERC verification, and final mask sign-off while aligning design, fabrication, testing and packaging requirements across the development cycle.

Join a human-centered team pushing advanced photonic and electronic integration to deliver

Qualifications

• Experience with tape-out flow and mask data preparation.
• Knowledge of GDS II data handling and mask data prep.
• Familiarity with DRC/LVS/ERC verification and mask sign-off requirements.

Responsibilities

• Own the complete tape-out flow including Mask GDS/MDP integration, DRC/LVS/ERC verification, final mask sign-off.
• Drive EIC+PIC DfX co-integration across a graphene photonics platform.
• Ensure alignment between design, fabrication, testing, and packaging throughout the development cycle.

Skills

Mask Data Preparation

GDS Data Integration

DRC/LVS/ERC verification

Tape-out flow

DFX co-integration

Tools

GDSII

MDP

Job description

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry.

The Role

We are seeking an experienced Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer to take technical ownership of the complete tape-out flow — from GDS database integration and mask data preparation through mask release, first silicon bring-up, and post-tapeout support. In this role, you will drive EIC+PIC DfX co-integration (Design for Functionality, Manufacturing, Test, Packaging, and Reliability) across a 300 mm graphene photonics platform, ensuring seamless alignment between design, fabrication, testing, and packaging requirements throughout the development cycle. To join our team, you should be excited to: Own the complete tape-out flow including Mask GDS/MDP integration, DRC/LVS/ERC verification, final mask sign-off, an