Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer (f/m/d)

Blacksemiconductor; Aachen; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Zusammenfassung

Black Semiconductor is seeking an experienced Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer to take ownership of the complete tape-out flow, from GDS database integration to mask release and post-tapeout support.

You will drive DfX co-integration across a 300 mm graphene photonics platform, aligning design, fabrication, testing, and packaging, with close collaboration across global teams.

Qualifikationen

• MS or PhD in Electrical Engineering, Physics, or related field with 5+ years in tape-out and MDP.

Aufgaben

• Own tape-out flow including GDS/MDP integration and final mask sign-off.
• Lead GDS and reticle-to-fab delivery and ensure compliance with fab specs.
• Drive DFM and DFT integration, hotspot mitigation, layout optimization.
• Design and integrate GDS structures (kerf, seal ring, frame, scanner marks, metrology).
• Interface between mask shops, lithography/metrology teams, EDA vendors, and cross-functional teams.
• Maintain GDS version control and support first-silicon debug and failure analysis.

Kenntnisse

Tape-out experience

Cross-functional collaboration

Project coordination

Ausbildung

MS or PhD in Electrical Engineering, Physics, or related field

Tools

Calibre

Synopsys ICV

GDSII/OASIS

JDV (Jobdeck View)

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude

In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking an experienced Electronic-Photonics IC Mask Data Preparation & GDS Data Integration Engineer to take technical ownership of the complete tape-out flow - from GDS database integration and mask data preparation through mask release, first silicon bring-up, and post-tapeout support.

In this role, you will drive EIC+PIC DfX co-integration (Design for Functionality, Manufacturing, Test, Packaging, and Reliability) across a 300 mm graphene photonics platform, ensuring seamless alignment between design, fabrication, testing, and packaging requirements throughout the development cycle.

Key Responsibilities

• Own the complete tape-out flow including Mask GDS/MDP integration, DRC/LVS/ERC verification, final mask sign-off, and rule file maintenance for PIC-EIC integration and new process nodes.
• Lead GDS and reticle-to-fab delivery, formal mask release activities, and ensure all layers, formats, and data structures comply with fab specifications.
• Drive DFM and DFT integration through yield optimization, hotspot mitigation, layout optimization, and implementation of scan chains, test pads, and optical probe structures within GDS.
• Design and integrate special GDS structures including kerf, seal ring, frame, scanner marks, metrology & PCM structures, ESD protection layouts, and RDL packaging interfaces.
• Act as the primary interface between mask shops, foundry lithography/metrology teams, EDA vendors, and cross-functional analog, digital, packaging, and reliability teams across global regions.
• Maintain GDS version control and audit-trail archiving while supporting first-silicon debug, layout-based failure analysis, and continuous improvement of MDP best practices.

Your Qualifications

• MS or PhD in Electrical Engineering, Physics, or a related field, with 5+ years of experience in semiconductor or photonics tape-out, layout integration, and Mask Data Preparation (MDP).
• Strong expertise in GDSII/OASIS, DRC/LVS/ERC verification flows, and industry-standard tools such as Calibre and Synopsys ICV, including MDP job deck authoring and JDV (Jobdeck View).
• Hands-on experience with production tape-out flows including DFM, DFT, ESD, seal ring/kerf, and RDL layout implementation.
• Familiarity with OPC flows for advanced photonics or CMOS nodes and experience coordinating with mask shops and foundry partners.
• Experience with Photonic IC technologies (Si, SiN, etc.), graphene or 2D-material integration, RF photonics, or photonic/electronic co-design EDA tools such as Cadence EPIC or Lumerical is considered a plus.
• Background in mask shops or EDA software environments (e.g. Synopsys, Siemens, Cadence, Toppan, Photronics, Compugraphics, Tekscend) is highly desirable.

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development

Your Health and Future Matter

Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future

We Live Openness

Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength ...