Senior Engineer in Multi-Physics Simulation via Leased Labor Contract for 18-Months

Huawei Research Center Germany & Austria; Deutschland; Vor Ort; EUR 60.000 - 100.000; Vollzeit

Zusammenfassung

Join a forward-thinking research center as a Senior Engineer in Multi-Physics Simulation. This role involves working on cutting-edge simulations in chip thermal dissipation and stress analysis, while tracking advancements in semiconductor technologies. You will collaborate with renowned academic organizations and be part of a diverse team that values innovation and knowledge exchange. The center offers a dynamic work environment with opportunities for continuous learning and professional growth. If you're passionate about pushing the boundaries of technology and want to make a significant impact, this position is for you.

Leistungen

Healthy Meals in Company Canteen

Training Opportunities

Diverse Work Environment

Self-Responsible Work

Qualifikationen

• Ph.D. in relevant fields with solid knowledge in semiconductors and innovative materials.
• Strong analytical abilities and self-learning capabilities are essential.

Aufgaben

• Conduct multiphysics simulations focusing on thermal dissipation and stress analysis.
• Provide reports on semiconductor technology developments and organize seminars.

Kenntnisse

Multi-Physics Simulation

Thermal Stress Analysis

Nano-/Micro-Fabrication Process

Device Thermal Dissipation Management

Analytical Abilities

Self-Learning Capabilities

Fluency in English

German Language Skills

Chinese Language Skills

Ausbildung

Ph.D. in Microelectronics or Related Fields

Jobbeschreibung

Huawei's Munich Research Center is responsible for advanced technology research, architectural development, design and strategic engineering of our products.

Join us as a

Senior Engineer in Multi-Physics Simulation

We are looking for a senior engineer in the topic of chiplet multi-physics simulation. Thermal, interconnection and stress are important issues in the development of highly integrated systems. I hope you will join our team to explore advanced packaging methods.

Your mission

• Working on Multiphysics simulation, with a focus on building simulation models in chip thermal dissipation, die-to-die communication, thermal stress analysis.
• Track the top-level conference articles about heat simulation methodology and heat dissipation solutions in the academic and industry.
• Provide insight reports based on the latest developments on semiconductor technologies, with a focus on heat dissipation, interconnection, and thermal stress.
• You will establish connections with well-known academic organizations (e.g., IEEE, ESIA, etc.) and connect with core members and experts of the organizations.
• You will assist in organizing internal seminars and workshops in related fields and maintain regular technical exchanges with academic and business partners.

Your areas of expertise

• Ph.D. degree with education background in microelectronics, nanotechnologies, physics of semiconductor, or other related domains.
• Solid knowledge in the following areas: semiconductors and innovative materials, nano-/micro-fabrication process (FEOL, BEOL), heterogeneous integration, 3DIC packaging, optoelectronic components, device thermal dissipation management, back-end test, etc.
• Possesses strong insight and analytical abilities in the field, as well as strong self-learning capabilities.
• Business trips in Germany and other European countries are required, mainly for conferences and seminars.
• Fluency in oral and written English is a must. Speaking German or Chinese is a plus, but not necessary.

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Your rewards of working here

• Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network.
• We offer healthy meals ranging from traditional Chinese to western delicacies in our famous company canteen.
• To keep your development ongoing, you will find a broad range of training opportunities. Many online and face-to-face training programs incl. language courses in German and Mandarin.
• Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities.
• Self-responsible work in a competent, motivated and constantly growing team.

Please send your application and CV (incl. cover letter and reference letters) in English.

Huawei is a leading global information and communications technology (ICT) solutions provider. Driven by a commitment to operations, ongoing innovation, and open collaboration, we have established a competitive ICT portfolio of end-to-end solutions in Telecom and enterprise networks, Devices and Cloud technology and services. Our ICT solutions, products and services are used in more than 170 countries and regions, serving over one-third of the world's population. With 197,000 employees, Huawei is committed to develop the future information society and build a Better Connected World.

Department: Marconi Laboratory
Locations: Munich