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ZEISS Group seeks an engineer to design, develop and introduce assembly and integration equipment for opto‑mechanical components used in production. You will define technical requirements, work with external partners, and drive end‑to‑end processes from concept to final release with a strong customer focus.
Collaborating with design, mechanical engineering, software and operations teams, you will ensure robust workflows and long‑term reliability, while maintaining high standards of quality and
ZEISS Semiconductor Manufacturing Technology
Enabler for smaller, more powerful, and more energy-efficient microchips
Working for tomorrow today.
Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.
We design and manage the assembly and integration processes for the entire ZEISS product portfolio – where highly complex optical components are turned into robust, high‑performance products for semiconductor manufacturing. This includes precise joining (screwing, bonding, welding, soldering), alignment and quality‑assured measurement. In this role, you will work closely with expert teams in design, mechanical engineering, equipment engineering, software and cleaning technology to jointly develop optimized tooling and efficient workflows. In close collaboration with Engineering and Operations, you will ensure that robust, high‑performance processes are successfully implemented on the Shopfloor and run reliably over the long term.
Your ZEISS Recruiting Team:
Sandra Köhler