Technical Staff Engineer - Signal Integrity

FHLB Des Moines; Ottawa; On-site; CAD 133,000 - 183,000; Full time

Benefits offered by this job

Health benefits from day one

Retirement savings plans

Industry-leading IESPP program

Job summary

Microchip Technology Inc. in Ontario is seeking a senior role in the Mixed-Signal Development Group to lead signal integrity for advanced device packaging.

You will supervise SI and power integrity, collaborate with PCB, mixed-signal and packaging teams, and help evolve SI processes across cutting-edge data center and optical processor designs. The position requires a Bachelor in Electronics Engineering with 12+ years SI experience, familiarity with HFSS/CST SIWave, ADS/Spectre/Hspice, and

Qualifications

• Bachelor degree in Electronics Engineering minimum.
• 12 years or more experience in signal integrity design or equivalent.
• Experience and knowledge of field solvers such as HFSS, CST MWS, SIWave.
• Experience and knowledge of circuit simulators like ADS, Spectre, Hspice.
• Understanding of electromagnetic and transmission line theory, I/O design, SI, differential and single-ended interface technology.
• Familiarity with PCB layout or electrical package design techniques.
• Knowledge of lab measurement equipment (oscilloscopes, TDR, VNA).
• Understanding of IBIS and IBIS-AMI.
• MATLAB experience is an asset.
• Scripting languages such as PERL, Python, SKILL are assets.
• Cadence Design Environment is an asset.

Responsibilities

• Oversee all aspects of Signal and Power integrity for device package designs.
• Collaborate with PCB, Mixed Signal, Product development and package designers to understand SI requirements.
• Work with package designers to create packaging meeting electrical specs.
• Help develop and evolve SI flows and processes.
• Support customers with SI simulations of complex channels and power systems.
• Produce SI models for internal and external customers.
• Analyze PCB and Package power systems.
• Model future systems for feasibility.
• Review PCB and Package designs.

Skills

Strong communication skills

Signal integrity

Electronics engineering knowledge

Education

Bachelor degree in Electronics Engineering

Tools

HFSS

CST MWS

SIWave

ADS

Spectre

Hspice

IBIS

MATLAB

Perl

Python

SKILL

Cadence Design Environment

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Job Description:

The Mixed Signal Development Group is responsible for delivering analog and Mixed-Signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From T1/E1 to 224Gb/s SERDES, we enable technology that allows Microchip’s products to interface to the outside world. As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team leader/manager and be engaged in the package designs of highly complex and cutting-edge data center and optical communication processors.

Responsibilities:

• Oversee all aspects of Signal and Power integrity for device package designs.
• Collaborate with PCB, Mixed Signal, Product development and package designers to understand SI requirements for devices and package designs.
• Work with package designers to create packaging that meets electrical design specifications.
• Help develop and evolve SI flows and processes
• Support internal and external customers with signal integrity simulations of complex channels and power systems
• Produce signal integrity models for usage by internal and external customers.
• Analysis and design of PCB and Package power systems
• Model future, yet to be designed, systems for the purposes of feasibility
• Review PCB and Package designs

Requirements / Qualifications:

• Bachelor degree in Electronics Engineering minimum.
• 12 years or more experience in signal integrity design or equivalent.
• Experience and knowledge of field solvers, such as HFSS, CST MWS, SIWave.
• Experience and knowledge of circuit simulators like ADS, Spectre, Hspice.
• Solid understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single ended interface technology
• Experienced and knowledgeable of Printed Circuit Board (PCB) layout or electrical package design techniques
• Familiarity and fundamental understanding of lab measurement equipment. Oscilloscopes, TDR, Vector Network Analyzer, etc.
• Understanding of IBIS and IBIS-AMI
• Experience with MATLAB is an asset.
• Scripting languages such as PERL, Python, and SKILL are an asset
• Innovative and creative thinker
• Experience with Cadence Design Environment an asset
• Strong written and oral communication skills

Travel Time: 0% - 25%

Pay Range: We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading IESPP program with a 6-month look back feature. Find more information about all our benefits at the link below: Benefits of working at Microchip The annual base salary range for this position is $133,000 - $183,000.* *Range is dependent on numerous factors including job location, skills and experience.

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