Staff Optical Sub Assembly Electrical Designer

Nokia; Ottawa; On-site; CAD 110,000 - 140,000; Full time

Job summary

Nokia in Ottawa is seeking an Optical Sub Assembly Electrical Designer to specification, design and implement digital and analog electrical hardware for next‑generation optical sub‑assemblies. You will drive high‑density circuits with low power, cost, and high yield, while collaborating across hardware, mechanical and software teams.

The role emphasizes end‑to‑end design, from block diagrams to schematics, mentorship of junior engineers, and engagement with supply chain and release management to

Qualifications

• Minimum B.Sc or B.Eng in Electrical Engineering or Computer Engineering.
• At least 10 years of hardware design experience with a strong grasp of the hardware product design lifecycle.
• Proficiency in schematic capture, symbol creation, and circuit layout software.
• In‑depth knowledge of PCB design processes, including multilayer and complex packaging.
• Strong verbal and written communication skills.

Responsibilities

• Lead the design and development of innovative electrical circuits for cutting‑edge optical modules and test platforms.
• Collaborate with Product Architects to convert product requirements into precise hardware specifications.
• Manage the end‑to‑end electrical design process from initial block diagrams to detailed schematics.
• Work with mechanical and software teams to ensure seamless integration of all designs.
• Coordinate with PCB layout experts to optimize electrical designs for manufacturability.
• Facilitate weekly program status updates and participate in release management meetings.
• Engage with Supply Chain to oversee material acquisition and prototype assembly.
• Mentor junior hardware team members and share technical guidance.

Skills

Strong verbal and written comms

Project leadership experience

Mentoring junior hardware team members

Education

B.Sc or B.Eng in Electrical Engineering or Computer Engineering

Tools

Schematic capture software

Circuit layout software

PCB design processes

HDI knowledge

MSAP knowledge

Oscilloscopes / Spectrum analyzers

Job description

As an Optical Sub Assembly Electrical Designer at Nokia, you will be instrumental in the specification, design, and implementation of cutting‑edge digital and analog electrical hardware for our next‑generation optical sub‑assemblies. Your expertise in analog design and simulation will help create high‑density units that meet rigorous targets for low cost, high yield, and reliability, all while ensuring low power consumption. This role offers a unique opportunity to contribute to innovative technologies, pushing the limits of what’s possible and developing designs that will shape the future of telecommunications. Join us in pioneering the next wave of advancements!

How You Will Contribute And What You Will Learn

• Lead the design and development of innovative electrical circuits for cutting‑edge optical modules and test platforms.
• Collaborate with Product Architects to convert product requirements into precise hardware specifications.
• Manage the end‑to‑end electrical design process from initial block diagrams to detailed schematics.
• Work in tandem with mechanical and software teams to ensure seamless integration of all designs.
• Coordinate with PCB layout experts to optimize electrical designs for efficient production.
• Facilitate weekly program status updates and contribute actively to release management meetings.
• Engage with Supply Chain representatives to oversee material acquisition and prototype assembly.
• Mentor junior hardware team members, providing technical guidance to enhance their skills and the overall team’s capabilities.

Key Skills And Experience

Must-Have

• Minimum B.Sc or B.Eng in Electrical Engineering or Computer Engineering
• At least 10 years of hardware design experience with a strong grasp of the hardware product design lifecycle
• Proficiency in schematic capture, symbol creation, and circuit layout software
• In‑depth knowledge of PCB design processes, including multilayer and complex packaging
• Strong verbal and written communication skills

Nice-To-Have

• Experience with HDI (High Density Interconnect) and MSAP
• Understanding of optical communications and transceiver designs
• Experience using digital test equipment like oscilloscopes and spectrum analyzers
• Familiarity with advanced modulation‑format telecommunication systems
• Experience leading projects and mentoring junior team members