Optical Packaging Engineer

Nokia; Ottawa; On-site; CAD 70,000 - 90,000; Full time

Benefits offered by this job

Corporate Retirement Savings Plan

Health and dental benefits

Employee Stock Purchase Plan

Tuition Assistance Plan

Job summary

Nokia is seeking a passionate Optical Packaging Engineer in Ottawa, Canada. The role focuses on leading the design of next‑generation optical solutions, collaborating with teams to optimize efficiency and ensure a smooth transition to mass production. Candidates should have 2-4 years of relevant experience and be knowledgeable about optical coupling, microelectronics, and packaging technologies. The position offers various corporate benefits including health insurance and retirement savings plans.

Qualifications

• 2-4 years of experience in optical packaging engineering.
• Experience with microelectronics and optoelectronics packaging design.
• Knowledgeable in materials properties and multilayer materials interfaces.

Responsibilities

• Lead optical package design with cross-functional teams.
• Own development activities for optical coupling and designs.
• Optimize optical coupling efficiency and meet production targets.

Skills

Experience in high-speed electronics package design

Experience with optical coupling

Hands-on experience with automated alignment tools

Solid interpersonal and problem-solving skills

Job description

Overview

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Optical Packaging Engineer to lead the development of next‑generation optical solutions. In this role, you'll be at the forefront of innovation, collaborating with cross‑functional teams to optimize optical coupling efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of fiber pigtail, lens coupling, and free space optics, while staying abreast of cutting‑edge technologies, we encourage you to apply!

Responsibilities

• Lead next generation optical package design in collaboration with cross‑functional teams, stakeholders and vendors to ensure package requirements are met.
• Own all the development of optical coupling activities and designs: fiber pigtail, lens alignment and coupling, free space optics, gratings, collimators, etc.
• Optimize the optical coupling efficiency of optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Hands‑on process development with the R&D manual aligners and automated aligner within Nokia premises.
• Survey advanced optical coupling solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support the development activities at our Contract Manufacturers, both remotely and on‑site to ensure a smooth transition to mass production.

Key Skills and Experience

• 2‑4 years of experience.
• Experience in high‑speed electronics package design and laser package design.
• Experience with optical coupling, fiber pigtail attachment, free space optics.
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Hands‑on experience with automated alignment tools, fiber optics, epoxy dispensation, optical measurement and metrology.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem‑solving skills to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.

Additional Preferred Skills

• Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools such as DOE, SPC, Six‑Sigma, and familiarity with Industry Test Standards such as JEDEC, EIA, Telcordia, Mil‑Std.
• Expertise in high‑volume packaging of 2.5/3D packages.
• Knowledge of material properties and associated mechanical part fabrication processes.
• Familiarity with flip chip, BGA, PCBA, flex design reliability and processing.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging or equivalent practical work experience.

Benefits (United States)

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short‑term disability and long‑term disability
• Life insurance and AD&DD – Company paid 2x base pay
• Optional or Supplemental life and AD&DD insurance (Employee/Spouse/Child)
• Paid time off for holidays and vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.

Equal Employment Opportunity Statement

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.