Principal RF/EM Engineer

Nokia; Ottawa; On-site; CAD 90,000 - 120,000; Full time

Job summary

A leading telecommunications company in Ottawa is seeking a Principal RF/EM Engineer to design innovative broadband circuits and systems. You will lead a dynamic team through complex challenges in RF structures and ASIC packaging, while implementing design validation and performance simulations. The ideal candidate will have a Master's or PhD in Electrical Engineering, at least 5 years of experience in HFSS modeling, and a passion for cutting-edge solutions that enhance telecommunications. This role promotes a culture of creativity, learning, and teamwork.

Qualifications

• Minimum of 5 years of experience in HFSS modeling and ADS.
• Proficient in measurements using VNAs and probing techniques.

Responsibilities

• Lead the design and development of advanced broadband circuits and ASIC packaging solutions.
• Conduct electromagnetic modeling and validation of RF structures.
• Perform end-to-end channel simulations and eye diagram analysis.
• Guide a multidisciplinary team in creating and verifying proof of concepts.
• Oversee substrate selection and detailed modeling for high-speed applications.
• Develop high-speed test fixtures and execute comprehensive design verification.
• Implement continuous improvements in signal integrity and modeling techniques.
• Collaborate with cross-functional teams to publish test reports.

Skills

HFSS modeling

Designing passive structures above 50 GHz

Measurements using VNAs

Probing techniques

Education

M.Sc./Ph.D. in Electrical Engineering with a focus on microwave design

Tools

MATLAB

Job description

Job Description

As a Principal RF/EM Engineer at Nokia, you will be at the forefront of designing innovative broadband circuits and systems that shape the future of telecommunications. Collaborating within a dynamic, multidisciplinary design team, you will tackle complex challenges in electromagnetic modeling, RF structures, and high-speed ASIC packaging. Your leadership in developing and validating state-of-the‑art designs will drive the development of next‑generation products. The work environment is collaborative and fast‑paced, filled with passionate professionals committed to pushing technological boundaries. You will thrive in a culture that encourages continuous learning, creativity, and teamwork while delivering cutting‑edge solutions that redefine network performance. Join us to make a meaningful impact in shaping the future of connectivity!

How You Will Contribute And What You Will Learn

• Lead the design and development of advanced broadband circuits and ASIC packaging solutions.
• Conduct electromagnetic modeling and validation of RF structures and IC package transitions.
• Perform end‑to‑end channel simulations and eye diagram analysis to ensure optimal performance.
• Guide a multidisciplinary team in creating and verifying proof of concepts and evaluation boards.
• Oversee substrate selection and detailed modeling of PCB, modules, and interconnects for high‑speed applications.
• Develop high‑speed test fixtures and calibration kits; execute comprehensive design verification up to 90 GHz.
• Implement continuous improvements in signal integrity and modeling techniques to enhance modeling accuracy.
• Collaborate with cross‑functional teams to publish test reports and provide actionable recommendations.

Key Skills And Experience

You have:

• M.Sc./Ph.D. in Electrical Engineering with a focus on microwave design
• Minimum of 5 years of experience in HFSS modeling and ADS
• Expertise in designing passive structures above 50 GHz
• Proficient in measurements using VNAs and probing techniques

It would be nice if you also had:

• Experience in Telecom product development
• Familiarity with PCB, HDBU, and mSAP fabrication techniques
• Knowledge of Electro‑optics and RF test equipment
• Proficiency in MATLAB and other simulation tools