Senior Optical Packaging & Flip-Chip Process Architect

Sanmina-SCI Systems de México; Ottawa; On-site; CAD 145,000 - 165,000; Full time

Job summary

A leading technology firm is seeking an industry expert in Ottawa to lead process architecture and development for next-generation optical and microelectronic solutions. The role requires deep expertise in flip-chip and wire bonding processes, with a Master's degree in a relevant engineering discipline and at least 8 years of practical experience. You will define assembly strategies, develop critical process recipes, and mentor junior engineers while working on cutting-edge technologies. A competitive salary between $145,000 and $165,000 annually is offered.

Qualifications

• Minimum 8+ years of direct experience in microelectronics packaging and process engineering.
• Strong understanding of material interactions, including underfills, epoxies, and gold-tin soldering.
• Proficiency in programming automated assembly equipment.

Responsibilities

• Define comprehensive assembly strategies for optoelectronic modules.
• Lead the development of critical process recipes and execution.
• Implement robust process controls and lead troubleshooting efforts.

Skills

Flip Chip

Wire Bonding

Statistical process control

Data analysis

Education

Master's Degree in Engineering (Materials, Electrical, Mechanical, or Physics)

Tools

AutoCad

SolidWorks

Job description

A leading technology firm is seeking an industry expert in Ottawa to lead process architecture and development for next-generation optical and microelectronic solutions. The role requires deep expertise in flip-chip and wire bonding processes, with a Master's degree in a relevant engineering discipline and at least 8 years of practical experience. You will define assembly strategies, develop critical process recipes, and mentor junior engineers while working on cutting-edge technologies. A competitive salary between $145,000 and $165,000 annually is offered.