Technical Fellow, Advanced Packaging & HPC Strategy

Tech Insights; Ottawa; On-site; CAD 175,000 - 195,000; Full time

Benefits offered by this job

Training and development opportunities

Comprehensive benefits package

Flexible vacation policy

Job summary

A leading semiconductor analytics firm in Ottawa is seeking a Technical Fellow to bridge advanced packaging and system performance. This role requires deep expertise in semiconductor packaging, processor architecture, and innovative technologies. The ideal candidate will have over ten years of experience, including a Master's or PhD in related fields. Responsibilities include shaping technology roadmaps, engaging with global clients, and leveraging AI for content creation. This position is designed for someone passionate about driving the future of semiconductor analysis.

Qualifications

• 10+ years of industry experience in semiconductor packaging or processor design.
• Familiarity with advanced packaging processes.
• Ability to connect architecture to system-level performance.

Responsibilities

• Lead as subject matter expert in advanced packaging.
• Shape and maintain technology roadmaps.
• Leverage AI to accelerate content creation.

Skills

Expertise in semiconductor packaging

AI and automation tools application

Communication and storytelling

Education

Master’s or PhD in relevant fields

Job description

A leading semiconductor analytics firm in Ottawa is seeking a Technical Fellow to bridge advanced packaging and system performance. This role requires deep expertise in semiconductor packaging, processor architecture, and innovative technologies. The ideal candidate will have over ten years of experience, including a Master's or PhD in related fields. Responsibilities include shaping technology roadmaps, engaging with global clients, and leveraging AI for content creation. This position is designed for someone passionate about driving the future of semiconductor analysis.