Senior High-Speed AMS IC Designer (Hybrid, Ottawa)

Cisco

Ottawa

Hybrid

CAD 204,000 - 275,000

Full time

13 days ago
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Job summary

Cisco is seeking a seasoned Mixed-Signal IC Design Engineer in Ottawa to design, lay out, and validate high-speed AMS circuits for optical communications products. You will architect, design, layout, measure and productize ultra-deep sub-micron CMOS designs with speeds >25Gb/s and high accuracy, collaborating with RF, DSP, and packaging teams.

You will mentor junior engineers, lead a block on a complex chip, and ensure signal integrity through design reviews and production handoffs in a dynamic

Qualifications

  • Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related experience.
  • Experience in design, simulation and measurement of high speed ICs in at least 3 of the areas listed.

Responsibilities

  • Lead a large block on a complex chip, mentor team members and track deliverables.
  • Participate in peer review of complex IC designs and provide solid design methodology from conception to production.
  • Collaborate with packaging and hardware design teams to ensure signal and power integrity specifications are met.
  • Develop high speed AMS circuits and best-in-class products that push boundaries of possible.
  • Collaborate with cross-functional teams and learn from colleagues in a team-oriented environment.

Skills

High-Speed IC design
Serial links
PLL design
Clock distribution
Op-amps
Equalization techniques
Mentoring

Education

Bachelor's degree in related field
Master's degree
PhD

Tools

Cadence (Virtuoso)
Spectre/APS/SpectreX
Layout tools (Virtuoso)
Calibre
EMX
MATLAB

Job description

Cisco is seeking a seasoned Mixed-Signal IC Design Engineer in Ottawa to design, lay out, and validate high-speed AMS circuits for optical communications products. You will architect, design, layout, measure and productize ultra-deep sub-micron CMOS designs with speeds >25Gb/s and high accuracy, collaborating with RF, DSP, and packaging teams.

You will mentor junior engineers, lead a block on a complex chip, and ensure signal integrity through design reviews and production handoffs in a dynamic

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