Get more replies from employers
Send a job-specific resume in minutes.
Broadcom in Ottawa is seeking a Senior Hardware Engineer to design, develop, and deliver ultra high‑performance electronic products. You will own all aspects of EE hardware design, including BOM creation, board design, development, validation, and vendor negotiations.
You will work with an interdisciplinary team across hardware, ASIC, signal, mechanical, and thermal engineering, taking products from concept to volume production while supporting customer trials and field issues.
As a Senior Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.
As a Senior Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.
You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams.
R026660