Principal Hardware Engineer

Broadcom; Ottawa; On-site; CAD 130,000 - 180,000; Full time

Job summary

Broadcom is seeking a Principal Hardware Engineer to design, develop, and deliver ultra high-performance electronic products. You will own all aspects of EE hardware design, including BOM creation, vendor interactions, circuit/board design, development, validation, and sustaining.

Lead a small design team in a fast-paced environment. You will collaborate with Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers and may interact with partner teams on

Qualifications

• Bachelor's degree in electrical engineering and 12+ years of related experience.
• Lifecycle product ownership of complex hardware products.
• Experience with large high-powered SOCs and advanced packaging (2D/2.5D/3D).

Skills

High-speed signaling

Circuit/board design

Power and thermal management

Product lifecycle ownership

Cross-functional collaboration

Team leadership

Education

Bachelor's degree in electrical engineering

Tools

Precision scopes

Analyzers

Development & validation tools

Job description

Job Description

As a Principal Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast‑paced, start‑up‑like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.

You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams.

Key Qualifications & Experience

• Large high‑powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 3D with 3D memories.
• Precision Scopes, Analyzers, development & validation tools.
• Power and Thermal issues associated with PCBs with 1kW+ footprints.
• High‑speed & High‑density signaling with SerDes rates of 112G+.
• Demonstrate lifecycle product ownership of complex products. Participating in a cross‑functional team from product inception to volume production.
• Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
• Bachelor's degree in electrical engineering and 12+ years of related experience.

Beneficial Experience

• Small Team Lead or proven technical mentor of High Speed Hardware designers.