Principal Hardware Engineer

Broadcom; Canada; On-site; CAD 100,000 - 120,000; Full time

Job summary

A leading semiconductor firm in Canada is seeking a Principal Hardware Engineer to design and deliver high-performance electronic products. The role involves leading a small team and collaborating with various engineering domains. Ideal candidates should have a Bachelor's degree in electrical engineering, over 12 years of experience, and expertise in advanced silicon technology. This position offers a full-time employment opportunity in a dynamic environment.

Qualifications

• 12+ years of related experience in hardware engineering.
• Experience with advanced silicon and packaging processes.
• Capability in mentoring small teams of high-speed hardware designers.

Responsibilities

• Design, develop, and deliver high-performance electronic products.
• Provide technical leadership to a small design team.
• Collaborate with interdisciplinary teams for product development.

Skills

Large high-powered SOCs

Precision scopes and analyzers

Power and thermal issues with PCBs

High-speed signaling with SerDes rates of 112G+

Lifecycle product ownership

Cross-functional collaboration

Education

Bachelor's degree in electrical engineering

Tools

Development and validation tools

Job description

As a Principal Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start‑up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.

You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, joint development programs may require extensive interaction with partner engineering teams.

Key Qualifications & Experience

• Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 3D memories.
• Precision scopes, analyzers, development and validation tools.
• Power and thermal issues associated with PCBs with 1kW+ footprints.
• High‑speed and high‑density signaling with SerDes rates of 112G+.
• Demonstrate lifecycle product ownership of complex products, participating in a cross‑functional team from product inception to volume production.
• Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
• Bachelor's degree in electrical engineering and 12+ years of related experience.

Beneficial Experience

• Small team lead or proven technical mentor of high‑speed hardware designers.

Seniority Level

Mid‑Senior level

Employment Type

Full‑time

Job Function

Engineering and Information Technology

Industries

Semiconductor Manufacturing