Principal Optical Packaging Architect — Advanced Integration

RANOVUS Inc.

Ottawa

On-site

CAD 150,000 - 200,000

Full time

8 days ago

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Job summary

Ranovus Inc. is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity.

You will own package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, and manufacturing transfer. You will work with design teams, suppliers, CMs, and OSAT partners to translate requirements into robust, scalable packaging solutions and

Qualifications

10+ years in advanced optical packaging or related field.
Ownership of packaging processes from development through production transfer.
Hands-on experience with flip-chip, BGA, laser packaging and optical alignment.
Experience with external manufacturing partners, equipment suppliers, or component vendors.

Responsibilities

Translate product requirements into packaging/assembly strategies and define build sequences, inspections, rework and test gates.
Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP) and manage warpage/VCS issues.
Lead laser packaging and hybrid integration development for laser-to-carrier/ePIC assemblies.
Define fiber attach strategies and automated fiber-attach station development (motion, vision, calibration).
Lead NPI, qualification and production transfer; define tooling, PFMEAs and control plans; drive RCA/CA.